Parametric results for: Op Amp under Operational Amplifiers
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MCP606T-I/SL
Telcom Semiconductor Inc
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Check for Price | Obsolete | 250 µV | 0.08 V/us | 1 | OPERATIONAL AMPLIFIER | 5 V | CMOS | 7 V | INDUSTRIAL | 155 | R-PDSO-G14 | Not Qualified | 91 dB | 85 °C | -40 °C | 14 | PLASTIC/EPOXY | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | DUAL | TELCOM SEMICONDUCTOR INC | PLASTIC, SOIC-14 | unknown | |||||||||||||||||||||||||||||||||||
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MCP606T-I/ST
Telcom Semiconductor Inc
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Check for Price | Transferred | 250 µV | 0.08 V/us | 1 | OPERATIONAL AMPLIFIER | 5 V | CMOS | 7 V | INDUSTRIAL | 155 | R-PDSO-G8 | Not Qualified | 91 dB | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | DUAL | TELCOM SEMICONDUCTOR INC | PLASTIC, TSSOP-8 | unknown | ||||||||||||||||||||||||||||||||||
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MCP606T-I/P
Telcom Semiconductor Inc
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Check for Price | Transferred | 250 µV | 0.08 V/us | 1 | OPERATIONAL AMPLIFIER | 5 V | CMOS | 7 V | INDUSTRIAL | 155 | R-PDIP-T8 | Not Qualified | 91 dB | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | TELCOM SEMICONDUCTOR INC | PLASTIC, DIP-8 | unknown | |||||||||||||||||||||||||||||||||||
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MCP606I/P
Microchip Technology Inc
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Check for Price | Yes | Yes | Active | 250 µV | 0.08 V/us | 80 pA | 1 | OPERATIONAL AMPLIFIER | 5 V | CMOS | 7 V | INDUSTRIAL | 155 | R-PDIP-T8 | Not Qualified | e3 | 91 dB | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 5.33 mm | 7.62 mm | 9.27 mm | MICROCHIP TECHNOLOGY INC | DIP, | compliant | DIP | 8 | |||||||||||||||||||||
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MCP606-I/OT
Microchip Technology Inc
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Check for Price | Yes | Yes | Active | 250 µV | 0.08 V/us | 80 pA | 25 µA | 1 | OPERATIONAL AMPLIFIER | 5 V | CMOS | VOLTAGE-FEEDBACK | YES | YES | YES | YES | NO | NO | 7 V | INDUSTRIAL | 155 | 100000 | NO | R-PDSO-G5 | Not Qualified | e3 | 91 dB | 1 | 85 °C | -40 °C | 260 | 5 | PLASTIC/EPOXY | LSSOP | TSOP5/6,.11,37 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) - annealed | GULL WING | 950 µm | DUAL | 1.45 mm | 1.55 mm | 2.9 mm | MICROCHIP TECHNOLOGY INC | LSSOP, TSOP5/6,.11,37 | compliant | SOT-23 | 5 | EAR99 | 8542.33.00.01 | ||||||||
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MCP606T-I/ST
Microchip Technology Inc
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Check for Price | Yes | Yes | Active | 250 µV | 0.08 V/us | 80 pA | 25 µA | 75 dB | 1 | OPERATIONAL AMPLIFIER | 5 V | CMOS | VOLTAGE-FEEDBACK | YES | YES | YES | YES | NO | NO | 7 V | INDUSTRIAL | 155 | 100000 | NO | R-PDSO-G8 | Not Qualified | e3 | 91 dB | 1 | 85 °C | -40 °C | 260 | TS 16949 | 40 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | TAPE AND REEL | YES | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 1.2 mm | 3 mm | 4.4 mm | MICROCHIP TECHNOLOGY INC | TSSOP, TSSOP8,.25 | compliant | SOIC | 8 | EAR99 | 8542.33.00.01 | Microchip | |||
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MCP606-I/P
Microchip Technology Inc
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$0.8004 | Yes | Yes | Active | 250 µV | 0.08 V/us | 80 pA | 25 µA | 75 dB | 1 | OPERATIONAL AMPLIFIER | 5 V | CMOS | VOLTAGE-FEEDBACK | YES | YES | YES | YES | NO | NO | 7 V | INDUSTRIAL | 155 | 100000 | NO | R-PDIP-T8 | Not Qualified | e3 | 91 dB | 85 °C | -40 °C | TS 16949 | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | TUBE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 5.33 mm | 7.62 mm | 9.27 mm | MICROCHIP TECHNOLOGY INC | 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8 | compliant | DIP | 8 | EAR99 | 8542.33.00.01 | Microchip | ||||||
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MCP606-I/SL
Telcom Semiconductor Inc
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Check for Price | Obsolete | 250 µV | 0.08 V/us | 1 | OPERATIONAL AMPLIFIER | 5 V | CMOS | 7 V | INDUSTRIAL | 155 | R-PDSO-G14 | Not Qualified | 91 dB | 85 °C | -40 °C | 14 | PLASTIC/EPOXY | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | DUAL | TELCOM SEMICONDUCTOR INC | PLASTIC, SOIC-14 | unknown | |||||||||||||||||||||||||||||||||||
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MCP606T-I/SN
Telcom Semiconductor Inc
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Check for Price | Transferred | 250 µV | 0.08 V/us | 1 | OPERATIONAL AMPLIFIER | 5 V | CMOS | 7 V | INDUSTRIAL | 155 | R-PDSO-G8 | Not Qualified | 91 dB | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | DUAL | TELCOM SEMICONDUCTOR INC | PLASTIC, SOIC-8 | unknown | ||||||||||||||||||||||||||||||||||
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MCP606-I/SNG
Microchip Technology Inc
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Check for Price | Yes | Yes | Active | 250 µV | 0.08 V/us | 80 pA | 1 | OPERATIONAL AMPLIFIER | 5 V | CMOS | 7 V | INDUSTRIAL | 155 | R-PDSO-G8 | Not Qualified | e3 | 91 dB | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 3.9 mm | 4.9 mm | MICROCHIP TECHNOLOGY INC | SOP, | compliant | SOIC | 8 | EAR99 | 8542.33.00.01 |