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MCP6052T-E/MNY
Microchip Technology Inc
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$0.9047 | Yes | Yes | Active | 150 µV | 0.15 V/us | 5 nA | 90 µA | 74 dB | 2 | OPERATIONAL AMPLIFIER | 3 V | CMOS | VOLTAGE-FEEDBACK | 100 pA | YES | YES | YES | YES | NO | NO | 7 V | AUTOMOTIVE | 385 | 56200 | NO | R-PDSO-N8 | Not Qualified | e4 | 91 dB | 1 | 125 °C | -40 °C | 260 | TS 16949 | 40 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.08,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | TAPE AND REEL | YES | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | DUAL | 800 µm | 2 mm | 3 mm | MICROCHIP TECHNOLOGY INC | DFN | HVSON, SOLCC8,.11,20 | 8 | compliant | EAR99 | 8542.33.00.01 | Microchip | ||
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MCP6052T-E/MNYVAO
Microchip Technology Inc
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Check for Price | Yes | Active | 150 µV | 0.15 V/us | 5 nA | 90 µA | 74 dB | 2 | OPERATIONAL AMPLIFIER | 3 V | CMOS | VOLTAGE-FEEDBACK | 100 pA | YES | YES | YES | YES | NO | NO | 7 V | AUTOMOTIVE | 385 | 56200 | NO | R-PDSO-N8 | e4 | 91 dB | 125 °C | -40 °C | AEC-Q100; TS 16949 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.08,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | TR | YES | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | DUAL | 800 µm | 2 mm | 3 mm | MICROCHIP TECHNOLOGY INC | HVSON, | compliant | EAR99 | 8542.33.00.01 | ||||||||||
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MCP6052-E/MNY
Microchip Technology Inc
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Check for Price | Yes | Yes | Active | 150 µV | 0.15 V/us | 100 pA | 90 µA | 2 | OPERATIONAL AMPLIFIER | 3 V | CMOS | VOLTAGE-FEEDBACK | 100 pA | YES | YES | YES | YES | 7 V | AUTOMOTIVE | 385 | 56200 | R-PDSO-N8 | Not Qualified | e4 | 91 dB | 1 | 125 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | DUAL | 800 µm | 2 mm | 3 mm | MICROCHIP TECHNOLOGY INC | DFN | HVSON, SOLCC8,.11,20 | 8 | compliant | EAR99 | 8542.33.00.01 |