Filter Your Search
1 - 6 of 6 results
|
AD8235ACBZ-P7
Analog Devices Inc
|
$3.4624 | No | Yes | Active | 2.5 mV | 23 kHz | 0.009 V/us | 600 pA | 50 µA | 10 | 100 dB | 1 | INSTRUMENTATION AMPLIFIER | 5 V | 130 pA | 0.001 % | 6 V | AUTOMOTIVE | 200 | 5 | R-PBGA-B11 | Not Qualified | e1 | 1 | 125 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 11 | PLASTIC/EPOXY | VFBGA | BGA11,3X4,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 500 µm | BOTTOM | 657 µm | 1.57 mm | 2.04 mm | ANALOG DEVICES INC | BGA | 1.50 X 2.20 MM, ROHS COMPLIANT, WLCSP-11 | 11 | CB-11-1 | compliant | EAR99 | 8542.33.00.01 | Analog Devices | ||||
|
MAX41400ANL+
Maxim Integrated Products
|
$2.0697 | Yes | Transferred | 35 µV | 28 kHz | 0.08 V/us | 300 pA | 90 µA | 40 | 106 dB | 1 | INSTRUMENTATION AMPLIFIER | 1.8 V | 4 V | 200 | 10 | R-PBGA-B9 | e2 | 1 | 125 °C | -40 °C | 260 | 30 | 9 | PLASTIC/EPOXY | VFBGA | BGA9,3X3,16 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER NICKEL | BALL | 400 µm | BOTTOM | 500 µm | 1.228 mm | 1.258 mm | MAXIM INTEGRATED PRODUCTS INC | WLP-9 | compliant | |||||||||||||||
|
MAX41400ANL+
Analog Devices Inc
|
Check for Price | Yes | Active | 35 µV | 28 kHz | 0.08 V/us | 300 pA | 90 µA | 40 | 106 dB | 1 | INSTRUMENTATION AMPLIFIER | 1.8 V | 4 V | 200 | 10 | R-PBGA-B9 | e2 | 1 | 125 °C | -40 °C | 260 | 30 | 9 | PLASTIC/EPOXY | VFBGA | BGA9,3X3,16 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | BALL | 400 µm | BOTTOM | 500 µm | 1.228 mm | 1.258 mm | ANALOG DEVICES INC | 9-WLCSP-N/A | WLP-9 | 9 | 9-WLCSP-N/A | compliant | Analog Devices | 2021-01-20 | ||||||||||
|
MAX41400ANL+T
Analog Devices Inc
|
Check for Price | Yes | Active | 35 µV | 28 kHz | 0.08 V/us | 300 pA | 90 µA | 40 | 106 dB | 1 | INSTRUMENTATION AMPLIFIER | 1.8 V | 4 V | 200 | 10 | R-PBGA-B9 | e2 | 1 | 125 °C | -40 °C | 260 | 30 | 9 | PLASTIC/EPOXY | VFBGA | BGA9,3X3,16 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | TR | YES | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | BALL | 400 µm | BOTTOM | 500 µm | 1.228 mm | 1.258 mm | ANALOG DEVICES INC | 9-WLCSP-N/A | WLP-9 | 9 | 9-WLCSP-N/A | compliant | Analog Devices | 2021-01-20 | |||||||||
|
AD8235ACBZ-P7
Rochester Electronics LLC
|
Check for Price | Yes | Yes | Active | 2.5 mV | 23 kHz | 0.009 V/us | 600 pA | 10 | 100 dB | 1 | INSTRUMENTATION AMPLIFIER | 5 V | 130 pA | 0.001 % | 6 V | AUTOMOTIVE | 200 | 5 | R-PBGA-B11 | COMMERCIAL | NOT SPECIFIED | 125 °C | -40 °C | 260 | 40 | 11 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | NOT SPECIFIED | BALL | 500 µm | BOTTOM | 657 µm | 1.57 mm | 2.04 mm | ROCHESTER ELECTRONICS INC | BGA | VFBGA, | 11 | unknown | |||||||||||
|
MAX41400ANL+T
Maxim Integrated Products
|
Check for Price | Yes | Transferred | 35 µV | 28 kHz | 0.08 V/us | 300 pA | 90 µA | 40 | 106 dB | 1 | INSTRUMENTATION AMPLIFIER | 1.8 V | 4 V | 200 | 10 | R-PBGA-B9 | e2 | 1 | 125 °C | -40 °C | 260 | 30 | 9 | PLASTIC/EPOXY | VFBGA | BGA9,3X3,16 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | TR | YES | TIN SILVER COPPER NICKEL | BALL | 400 µm | BOTTOM | 500 µm | 1.228 mm | 1.258 mm | MAXIM INTEGRATED PRODUCTS INC | WLP-9 | compliant |