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MAX9063EBS+TG45
Maxim Integrated Products
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$0.8584 | Yes | Transferred | 15 nA | 1.1 µA | 15 µs | 1 | COMPARATOR | 3.3 V | BICMOS | OPEN-DRAIN | 6 V | INDUSTRIAL | S-PBGA-B4 | Not Qualified | e2 | 1 | 85 °C | -40 °C | 260 | 30 | 4 | PLASTIC/EPOXY | BGA | BGA4,2X2,20 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER NICKEL | BALL | 500 µm | BOTTOM | MAXIM INTEGRATED PRODUCTS INC | UCSP-4 | compliant | EAR99 | 8542.39.00.01 | |||||||||
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MAX9061EBS+TG45
Maxim Integrated Products
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$0.5719 | Yes | Transferred | 9 mV | 100 nA | 25 µs | 1 | COMPARATOR | 1.8 V | BICMOS | OPEN-DRAIN | 6 V | INDUSTRIAL | S-PBGA-B4 | Not Qualified | e2 | 1 | 85 °C | -40 °C | 260 | 30 | 4 | PLASTIC/EPOXY | BGA | BGA4,2X2,20 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER NICKEL | BALL | 500 µm | BOTTOM | MAXIM INTEGRATED PRODUCTS INC | BGA, BGA4,2X2,20 | compliant | EAR99 | 8542.39.00.01 | |||||||||
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MAX9064EBS+TG45
Maxim Integrated Products
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$0.8764 | Yes | Transferred | 15 nA | 1.1 µA | 15 µs | 1 | COMPARATOR | 3.3 V | BICMOS | PUSH-PULL | 6 V | INDUSTRIAL | S-PBGA-B4 | Not Qualified | e2 | 1 | 85 °C | -40 °C | 260 | 30 | 4 | PLASTIC/EPOXY | BGA | BGA4,2X2,20 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER NICKEL | BALL | 500 µm | BOTTOM | MAXIM INTEGRATED PRODUCTS INC | BGA, BGA4,2X2,20 | compliant | EAR99 | 8542.39.00.01 | |||||||||
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MAX9060EBS+TG45
Maxim Integrated Products
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$0.8412 | Yes | Transferred | 9 mV | 100 nA | 25 µs | 1 | COMPARATOR | 1.8 V | BICMOS | OPEN-DRAIN | 6 V | INDUSTRIAL | S-PBGA-B4 | Not Qualified | e2 | 1 | 85 °C | -40 °C | 260 | 30 | 4 | PLASTIC/EPOXY | BGA | BGA4,2X2,20 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER NICKEL | BALL | 500 µm | BOTTOM | MAXIM INTEGRATED PRODUCTS INC | UCSP-4 | compliant | EAR99 | 8542.39.00.01 | |||||||||
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MAX9063EBS+TG45
Analog Devices Inc
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Check for Price | Yes | Active | 9 mV | 15 nA | 1.1 µA | 15 µs | 1 | COMPARATOR | 3.3 V | BICMOS | OPEN-DRAIN | 6 V | INDUSTRIAL | S-PBGA-B4 | Not Qualified | e2 | 1 | 85 °C | -40 °C | 260 | 30 | 4 | PLASTIC/EPOXY | BGA | BGA4,2X2,20 | SQUARE | GRID ARRAY | YES | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | BALL | 500 µm | BOTTOM | ANALOG DEVICES INC | UCSP-4 | compliant | 4-WLCSP-N/A | 4 | 4-WLCSP-N/A | 2008-05-07 | Analog Devices | |||||
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MAX9060EBS+TG45
Analog Devices Inc
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Check for Price | Yes | Active | 9 mV | 100 nA | 25 µs | 1 | COMPARATOR | 1.8 V | BICMOS | OPEN-DRAIN | 6 V | INDUSTRIAL | S-PBGA-B4 | Not Qualified | e2 | 1 | 85 °C | -40 °C | 260 | 30 | 4 | PLASTIC/EPOXY | BGA | BGA4,2X2,20 | SQUARE | GRID ARRAY | YES | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | BALL | 500 µm | BOTTOM | ANALOG DEVICES INC | UCSP-4 | compliant | 4-WLCSP-N/A | 4 | 4-WLCSP-N/A | 2008-05-07 | Analog Devices | ||||||
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MAX9061EBS+TG45
Analog Devices Inc
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Check for Price | Yes | Active | 9 mV | 100 nA | 25 µs | 1 | COMPARATOR | 1.8 V | BICMOS | OPEN-DRAIN | 6 V | INDUSTRIAL | S-PBGA-B4 | Not Qualified | e2 | 1 | 85 °C | -40 °C | 260 | 30 | 4 | PLASTIC/EPOXY | BGA | BGA4,2X2,20 | SQUARE | GRID ARRAY | YES | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | BALL | 500 µm | BOTTOM | 4-WLCSP-N/A | 4 | 4-WLCSP-N/A | 2008-05-07 | Analog Devices | |||||||||
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MAX9064EBS+TG45
Analog Devices Inc
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Check for Price | Yes | Active | 9 mV | 15 nA | 1.1 µA | 15 µs | 1 | COMPARATOR | 3.3 V | BICMOS | PUSH-PULL | 6 V | INDUSTRIAL | S-PBGA-B4 | Not Qualified | e2 | 1 | 85 °C | -40 °C | 260 | 30 | 4 | PLASTIC/EPOXY | BGA | BGA4,2X2,20 | SQUARE | GRID ARRAY | YES | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | BALL | 500 µm | BOTTOM | 4-WLCSP-N/A | 4 | 4-WLCSP-N/A | 2008-05-07 | Analog Devices | ||||||||
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MAX972EBL-T
Rochester Electronics LLC
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Check for Price | No | Active | 10 mV | 300 µs | 2 | COMPARATOR | 3 V | OPEN-DRAIN | 12 V | INDUSTRIAL | S-XBGA-B8 | COMMERCIAL | 1 | 85 °C | -40 °C | 245 | NOT SPECIFIED | 8 | UNSPECIFIED | BGA | SQUARE | GRID ARRAY | YES | NOT SPECIFIED | BALL | BOTTOM | ROCHESTER ELECTRONICS LLC | UCSP-8 | unknown | BGA | 8 | ||||||||||||||
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MAX972EBL-T
Maxim Integrated Products
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Check for Price | No | No | Transferred | 10 mV | 3.8 µA | 300 µs | 2 | COMPARATOR | 3 V | OPEN-DRAIN | 12 V | INDUSTRIAL | S-XBGA-B8 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 8 | UNSPECIFIED | BGA | BGA8,3X3,20 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 500 µm | BOTTOM | MAXIM INTEGRATED PRODUCTS INC | BGA, BGA8,3X3,20 | not_compliant | EAR99 | 8542.39.00.01 | BGA | 8 |