Parametric results for: Op Amp under Buffer Amplifiers

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Technology: BICMOS Sorted By: Risk Rank
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ADCLK914BCPZ-R7
Analog Devices Inc
$15.2353 No Yes Active 1 BUFFER 3.3 V BICMOS 6 V AUTOMOTIVE S-XQCC-N16 Not Qualified e3 3 125 °C -40 °C 260 40 16 UNSPECIFIED HVQCCN SQUARE CHIP CARRIER YES Matte Tin (Sn) - annealed NO LEAD 500 µm QUAD 900 µm 3 mm 3 mm ANALOG DEVICES INC QFN LFCSP-16 16 CP-16-22 compliant EAR99 8542.39.00.01 Analog Devices
ADCLK914BCPZ-R2
Analog Devices Inc
$14.0635 No Yes Active 1 BUFFER 3.3 V BICMOS 6 V AUTOMOTIVE S-XQCC-N16 Not Qualified e3 3 125 °C -40 °C 260 40 16 UNSPECIFIED HVQCCN SQUARE CHIP CARRIER TR YES Matte Tin (Sn) - annealed NO LEAD 500 µm QUAD 900 µm 3 mm 3 mm ANALOG DEVICES INC QFN LFCSP-16 16 CP-16-22 compliant EAR99 8542.39.00.01 Analog Devices
ADCLK914BCPZ-WP
Analog Devices Inc
$15.1593 No Yes Active 1 BUFFER 3.3 V BICMOS 6 V AUTOMOTIVE S-XQCC-N16 Not Qualified e3 3 125 °C -40 °C 260 40 16 UNSPECIFIED HVQCCN SQUARE CHIP CARRIER YES Matte Tin (Sn) - annealed NO LEAD 500 µm QUAD 900 µm 3 mm 3 mm ANALOG DEVICES INC QFN LFCSP-16 16 CP-16-22 compliant EAR99 8542.39.00.01 Analog Devices
MAX4206ETE+
Analog Devices Inc
$9.3856 Yes Active 5 mV 12 V/us 1 nA 7.5 mA 1 BUFFER 5 V -5 V BICMOS -6 V 12 V INDUSTRIAL S-XQCC-N16 Not Qualified e3 1 85 °C -40 °C 260 30 16 UNSPECIFIED HVQCCN LCC16,.16SQ,25 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES Matte Tin (Sn) NO LEAD 650 µm QUAD 800 µm 4 mm 4 mm 16-LFCSP-4X4X0.75 16 16-LFCSP-4X4X0.75 Analog Devices 2004-01-06
MAX4206ETE+
Maxim Integrated Products
$4.6826 Yes Yes Transferred 5 mV 12 V/us 1 nA 7.5 mA 1 BUFFER 5 V -5 V BICMOS -6 V 12 V INDUSTRIAL S-XQCC-N16 Not Qualified e3 1 85 °C -40 °C 260 30 16 UNSPECIFIED HVQCCN LCC16,.16SQ,25 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES MATTE TIN NO LEAD 650 µm QUAD 800 µm 4 mm 4 mm MAXIM INTEGRATED PRODUCTS INC QFN HVQCCN, LCC16,.16SQ,25 16 compliant EAR99 8542.33.00.01
MAX4208AUA+
Maxim Integrated Products
$3.1435 Yes Transferred 60 µV 0.08 V/us 3 mA 90 dB 1 INSTRUMENTATION AMPLIFIER 5 V BICMOS 0.0025 % 6 V AUTOMOTIVE R-PDSO-G8 Not Qualified e3 1 125 °C -40 °C 260 30 8 PLASTIC/EPOXY TSSOP TSSOP8,.19 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 1.1 mm 3 mm 3 mm MAXIM INTEGRATED PRODUCTS INC compliant EAR99 8542.33.00.01
MAX4208AUA+T
Maxim Integrated Products
$3.5854 Yes Yes Transferred 60 µV 0.08 V/us 3 mA 90 dB 1 INSTRUMENTATION AMPLIFIER 5 V BICMOS 0.0025 % 6 V AUTOMOTIVE S-PDSO-G8 Not Qualified e3 1 125 °C -40 °C 260 30 8 PLASTIC/EPOXY TSSOP TSSOP8,.19 SQUARE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH TR YES MATTE TIN GULL WING 650 µm DUAL 1.1 mm 3 mm 3 mm MAXIM INTEGRATED PRODUCTS INC TSSOP LEAD FREE, MO-187CAA, MICRO, SOP-8 8 compliant EAR99 8542.33.00.01
MAX4209HAUA+
Maxim Integrated Products
$2.7723 Yes Transferred 2.3 mA 1 BUFFER 5 V BICMOS AUTOMOTIVE R-PDSO-G8 Not Qualified e3 1 125 °C -40 °C 260 30 8 PLASTIC/EPOXY TSSOP TSSOP8,.19 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 635 µm DUAL MAXIM INTEGRATED PRODUCTS INC compliant EAR99 8542.33.00.01
MAX4206ETE+T
Analog Devices Inc
Check for Price Yes Active 5 mV 12 V/us 1 nA 7.5 mA 1 BUFFER 5 V -5 V BICMOS -6 V 12 V INDUSTRIAL S-XQCC-N16 Not Qualified e3 1 85 °C -40 °C 260 30 16 UNSPECIFIED HVQCCN LCC16,.16SQ,25 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES Matte Tin (Sn) NO LEAD 650 µm QUAD 800 µm 4 mm 4 mm ANALOG DEVICES INC 16-LFCSP-4X4X0.75 4 X 4 MM, 0.8 MM HEIGHT, MO-220-WGGC, TQFN-16 16 16-LFCSP-4X4X0.75 compliant Analog Devices 2004-01-06
AD8569ARMZ-REEL
Rochester Electronics LLC
Check for Price Yes Yes Active 10 mV 6 MHz 6 V/us 800 nA 4 BUFFER 4.5 V BICMOS 18 V INDUSTRIAL S-PDSO-G10 COMMERCIAL e3 1 85 °C -40 °C 260 40 10 PLASTIC/EPOXY TSSOP SQUARE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.1 mm 3 mm 3 mm ROCHESTER ELECTRONICS INC TSSOP TSSOP, 10 unknown