Parametric results for: Op Amp under Buffer Amplifiers
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ADCLK914BCPZ-R7
Analog Devices Inc
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$15.0289 | No | Yes | Active | 1 | BUFFER | 3.3 V | BICMOS | 6 V | AUTOMOTIVE | S-XQCC-N16 | Not Qualified | e3 | 3 | 125 °C | -40 °C | 260 | 40 | 16 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER | YES | Matte Tin (Sn) - annealed | NO LEAD | 500 µm | QUAD | 900 µm | 3 mm | 3 mm | ANALOG DEVICES INC | QFN | LFCSP-16 | 16 | CP-16-22 | compliant | EAR99 | 8542.39.00.01 | Analog Devices | ||||||||||||||
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ADCLK914BCPZ-R2
Analog Devices Inc
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$14.7788 | No | Yes | Active | 1 | BUFFER | 3.3 V | BICMOS | 6 V | AUTOMOTIVE | S-XQCC-N16 | Not Qualified | e3 | 3 | 125 °C | -40 °C | 260 | 40 | 16 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER | TR | YES | Matte Tin (Sn) - annealed | NO LEAD | 500 µm | QUAD | 900 µm | 3 mm | 3 mm | ANALOG DEVICES INC | QFN | LFCSP-16 | 16 | CP-16-22 | compliant | EAR99 | 8542.39.00.01 | Analog Devices | |||||||||||||
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ADCLK914BCPZ-WP
Analog Devices Inc
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$15.1593 | No | Yes | Active | 1 | BUFFER | 3.3 V | BICMOS | 6 V | AUTOMOTIVE | S-XQCC-N16 | Not Qualified | e3 | 3 | 125 °C | -40 °C | 260 | 40 | 16 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER | YES | Matte Tin (Sn) - annealed | NO LEAD | 500 µm | QUAD | 900 µm | 3 mm | 3 mm | ANALOG DEVICES INC | QFN | LFCSP-16 | 16 | CP-16-22 | compliant | EAR99 | 8542.39.00.01 | Analog Devices | ||||||||||||||
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MAX4206ETE+
Analog Devices Inc
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$10.0533 | Yes | Active | 5 mV | 12 V/us | 1 nA | 7.5 mA | 1 | BUFFER | 5 V | -5 V | BICMOS | -6 V | 12 V | INDUSTRIAL | S-XQCC-N16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.16SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 650 µm | QUAD | 800 µm | 4 mm | 4 mm | 16-LFCSP-4X4X0.75 | 16 | 16-LFCSP-4X4X0.75 | Analog Devices | 2004-01-06 | ||||||||||||
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MAX4206ETE+
Maxim Integrated Products
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$4.6826 | Yes | Yes | Transferred | 5 mV | 12 V/us | 1 nA | 7.5 mA | 1 | BUFFER | 5 V | -5 V | BICMOS | -6 V | 12 V | INDUSTRIAL | S-XQCC-N16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.16SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 650 µm | QUAD | 800 µm | 4 mm | 4 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, LCC16,.16SQ,25 | 16 | compliant | EAR99 | 8542.33.00.01 | |||||||||
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LTC6417IUDC#PBF
Linear Technology
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$4.1766 | Yes | Transferred | 3.2 mV | 1.6 GHz | 10 V/us | 145 mA | 1 | BUFFER | 13 µA | 100 mA | 5.25 V | INDUSTRIAL | R-PQCC-N20 | e3 | 1 | 105 °C | -40 °C | 260 | 30 | 20 | PLASTIC/EPOXY | HVQCCN | LCC20,.12X.16,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | QUAD | 800 µm | 3 mm | 4 mm | LINEAR TECHNOLOGY CORP | QFN | QFN-20 | 20 | UDC | compliant | EAR99 | 8542.33.00.01 | ||||||||||||
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LTC6417CUDC#PBF
Linear Technology
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$3.7826 | Yes | Transferred | 3.2 mV | 1.6 GHz | 10 V/us | 145 mA | 1 | BUFFER | 5 V | 13 µA | 100 mA | 5.25 V | COMMERCIAL | R-PQCC-N20 | e3 | 1 | 70 °C | 260 | 30 | 20 | PLASTIC/EPOXY | HVQCCN | LCC20,.12X.16,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | QUAD | 800 µm | 3 mm | 4 mm | LINEAR TECHNOLOGY CORP | QFN | QFN-20 | 20 | UDC | compliant | EAR99 | 8542.33.00.01 | ||||||||||||
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MAX4206ETE+T
Analog Devices Inc
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Check for Price | Yes | Active | 5 mV | 12 V/us | 1 nA | 7.5 mA | 1 | BUFFER | 5 V | -5 V | BICMOS | -6 V | 12 V | INDUSTRIAL | S-XQCC-N16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.16SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 650 µm | QUAD | 800 µm | 4 mm | 4 mm | ANALOG DEVICES INC | 16-LFCSP-4X4X0.75 | 4 X 4 MM, 0.8 MM HEIGHT, MO-220-WGGC, TQFN-16 | 16 | 16-LFCSP-4X4X0.75 | compliant | Analog Devices | 2004-01-06 | |||||||||
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MAX4206ETE+T
Maxim Integrated Products
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Check for Price | Yes | Yes | Transferred | 5 mV | 12 V/us | 1 nA | 7.5 mA | 1 | BUFFER | 5 V | -5 V | BICMOS | -6 V | 12 V | INDUSTRIAL | S-XQCC-N16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.16SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 650 µm | QUAD | 800 µm | 4 mm | 4 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 4 X 4 MM, 0.8 MM HEIGHT, MO-220-WGGC, TQFN-16 | 16 | compliant | EAR99 | 8542.33.00.01 | |||||||||
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EL5223CLZ
Renesas Electronics Corporation
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Check for Price | Yes | Active | 12 mV | 12 MHz | 15 V/us | 50 nA | 8 | BUFFER | 5 V | -5 V | CMOS | -9 V | 9 V | INDUSTRIAL | R-PQCC-N24 | e3 | 85 °C | -40 °C | 24 | PLASTIC/EPOXY | HVQCCN | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | QUAD | 1 mm | 4 mm | 5 mm | RENESAS ELECTRONICS CORP | QFN-24 | compliant | EAR99 | 8542.33.00.01 |