Parametric results for: Op Amp under Buffer Amplifiers

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EL5227CL
Intersil Corporation
Check for Price No Transferred 15 mV 2.5 MHz 1.5 V/us 50 nA 8 BUFFER 5 V -5 V -9 V 9 V INDUSTRIAL R-XQCC-N24 Not Qualified 85 °C -40 °C 24 UNSPECIFIED RECTANGULAR CHIP CARRIER YES NO LEAD QUAD INTERSIL CORP QFN LPP-24 24 not_compliant EAR99 8542.33.00.01
EL5227C
Intersil Corporation
Check for Price No Transferred 15 mV 2.5 MHz 1.5 V/us 50 nA 8 BUFFER 5 V -5 V -9 V 9 V INDUSTRIAL R-PDSO-G20 Not Qualified 85 °C -40 °C 20 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE YES GULL WING DUAL INTERSIL CORP TSSOP , 20 compliant EAR99 8542.33.00.01
EL5227CLZ
Intersil Corporation
Check for Price Yes Obsolete 15 mV 2.5 MHz 50 nA 1.55 mA 8 BUFFER 5 V -5 V CMOS 50 nA -9 V 0.9 V/us 9 V INDUSTRIAL R-XQCC-N24 Not Qualified e3 3 85 °C -40 °C 260 30 24 UNSPECIFIED HVQCCN LCC24,.16X.2,20 RECTANGULAR CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES MATTE TIN NO LEAD 500 µm QUAD 1 mm 4 mm 5 mm INTERSIL CORP QFN, TSSOP LEAD FREE, EXPOSED PAD, LPP-24 24, 20 compliant EAR99 8542.33.00.01
EL5227CLZ-T7
Intersil Corporation
Check for Price Yes Obsolete 15 mV 2.5 MHz 50 nA 1.55 mA 8 BUFFER 5 V -5 V CMOS 50 nA -9 V 0.9 V/us 9 V INDUSTRIAL R-XQCC-N24 Not Qualified e3 3 85 °C -40 °C 260 30 24 UNSPECIFIED HVQCCN LCC24,.16X.2,20 RECTANGULAR CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES MATTE TIN NO LEAD 500 µm QUAD 1 mm 4 mm 5 mm INTERSIL CORP QFN, TSSOP HVQCCN, LCC24,.16X.2,20 24, 20 compliant EAR99 8542.33.00.01
EL5227CLZ-T13
Intersil Corporation
Check for Price Yes Obsolete 15 mV 2.5 MHz 50 nA 1.55 mA 8 BUFFER 5 V -5 V CMOS 50 nA -9 V 0.9 V/us 9 V INDUSTRIAL R-XQCC-N24 Not Qualified e3 3 85 °C -40 °C 260 30 24 UNSPECIFIED HVQCCN LCC24,.16X.2,20 RECTANGULAR CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES MATTE TIN NO LEAD 500 µm QUAD 1 mm 4 mm 5 mm INTERSIL CORP QFN, TSSOP HVQCCN, LCC24,.16X.2,20 24, 20 compliant EAR99 8542.33.00.01
EL5227CR-T7
Renesas Electronics Corporation
Check for Price Obsolete 15 mV 2.5 MHz 2.2 V/us 50 nA 1.4 mA 1 BUFFER 5 V -5 V CMOS 50 nA -9 V 0.9 V/us 9 V INDUSTRIAL R-PDSO-G20 85 °C -40 °C 20 PLASTIC/EPOXY TSSOP TSSOP20,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH TR YES GULL WING 650 µm DUAL 1.2 mm 4.4 mm 6.5 mm RENESAS ELECTRONICS CORP TSSOP, TSSOP20,.25 compliant EAR99 8542.33.00.01
EL5227CL
Renesas Electronics Corporation
Check for Price Obsolete 15 mV 2.5 MHz 2.2 V/us 50 nA 1.4 mA 1 BUFFER 5 V -5 V CMOS 50 nA -9 V 0.9 V/us 9 V INDUSTRIAL R-XQCC-N24 85 °C -40 °C 24 UNSPECIFIED HVQCCN LCC24,.16X.2,20 RECTANGULAR CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES NO LEAD 500 µm QUAD 1 mm 4 mm 5 mm RENESAS ELECTRONICS CORP HVQCCN, LCC24,.16X.2,20 compliant EAR99 8542.33.00.01
EL5227CL-T7
Renesas Electronics Corporation
Check for Price Obsolete 15 mV 2.5 MHz 2.2 V/us 50 nA 1.4 mA 1 BUFFER 5 V -5 V CMOS 50 nA -9 V 0.9 V/us 9 V INDUSTRIAL R-XQCC-N24 85 °C -40 °C 24 UNSPECIFIED HVQCCN LCC24,.16X.2,20 RECTANGULAR CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE TR YES NO LEAD 500 µm QUAD 1 mm 4 mm 5 mm RENESAS ELECTRONICS CORP HVQCCN, LCC24,.16X.2,20 compliant EAR99 8542.33.00.01
EL5227CR-T13
Renesas Electronics Corporation
Check for Price Obsolete 15 mV 2.5 MHz 2.2 V/us 50 nA 1.4 mA 1 BUFFER 5 V -5 V CMOS 50 nA -9 V 0.9 V/us 9 V INDUSTRIAL R-PDSO-G20 85 °C -40 °C 20 PLASTIC/EPOXY TSSOP TSSOP20,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH TR YES GULL WING 650 µm DUAL 1.2 mm 4.4 mm 6.5 mm RENESAS ELECTRONICS CORP TSSOP, TSSOP20,.25 compliant EAR99 8542.33.00.01
EL5227CR
Renesas Electronics Corporation
Check for Price Obsolete 15 mV 2.5 MHz 2.2 V/us 50 nA 1.4 mA 1 BUFFER 5 V -5 V CMOS 50 nA -9 V 0.9 V/us 9 V INDUSTRIAL R-PDSO-G20 85 °C -40 °C 20 PLASTIC/EPOXY TSSOP TSSOP20,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES GULL WING 650 µm DUAL 1.2 mm 4.4 mm 6.5 mm RENESAS ELECTRONICS CORP TSSOP, TSSOP20,.25 compliant EAR99 8542.33.00.01