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MR27V3255D-XXMB
OKI Electric Industry Co Ltd
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Check for Price | Transferred | 33.5544 Mbit | 32 | 1MX32 | 3.3 V | 70 ns | MASK ROM | 16 | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G70 | Not Qualified | 70 °C | 70 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | GULL WING | 800 µm | DUAL | 3.05 mm | 28.6 mm | 12.7 mm | OKI ELECTRIC INDUSTRY CO LTD | SSOP | 0.500 INCH, 0.80 MM PITCH, PLASTIC, SSOP-70 | 70 | unknown | EAR99 | 8542.32.00.71 | |||||||||||||
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K3P6C1000F-TC15
Samsung Semiconductor
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Check for Price | No | Obsolete | 33.5544 Mbit | 16 | 2MX16 | 5 V | 150 ns | MASK ROM | 8 | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | PARALLEL | 50 µA | 150 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDSO-G44 | Not Qualified | e0 | 70 °C | 44 | PLASTIC/EPOXY | TSOP2 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN LEAD | GULL WING | 800 µm | DUAL | 1.2 mm | 18.41 mm | 10.16 mm | SAMSUNG SEMICONDUCTOR INC | TSOP2 | TSOP2, TSOP44,.46,32 | 44 | compliant | EAR99 | 8542.32.00.71 | |||||||
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KM23C512I-25
Samsung Semiconductor
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Check for Price | No | No | Contact Manufacturer | 524.288 kbit | 8 | 64KX8 | 5 V | 250 ns | MASK ROM | 1 | 64000 | 65.536 k | ASYNCHRONOUS | PARALLEL | 40 µA | 40 µA | CMOS | INDUSTRIAL | R-PDIP-T28 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | SAMSUNG SEMICONDUCTOR INC | DIP, DIP28,.6 | compliant | EAR99 | 8542.32.00.71 | ||||||||||||
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X15ST88NNCFC
Microsemi Corporation
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Check for Price | Obsolete | MICROSEMI CORP | , | compliant | EAR99 | 8542.32.00.71 | ||||||||||||||||||||||||||||||||||||||||||||||
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M23C1001B1
STMicroelectronics
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Check for Price | No | No | Obsolete | 1.0486 Mbit | 8 | 128KX8 | 5 V | 100 ns | MASK ROM | AUTOMATIC POWER-DOWN | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 20 µA | 40 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDIP-T32 | Not Qualified | e0 | 70 °C | 32 | PLASTIC/EPOXY | DIP | DIP32,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 41.91 mm | 15.24 mm | STMICROELECTRONICS | DIP | PLASTIC, DIP-32 | 32 | not_compliant | EAR99 | 8542.32.00.71 | |||||
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KM23C4100B-12
Samsung Semiconductor
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Check for Price | No | No | Obsolete | 4.1943 Mbit | 8 | 512KX8 | 5 V | 120 ns | MASK ROM | 16 | 1 | 512000 | 524.288 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 50 µA | 60 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDIP-T40 | Not Qualified | e0 | 70 °C | 40 | PLASTIC/EPOXY | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 52.43 mm | 15.24 mm | SAMSUNG SEMICONDUCTOR INC | DIP | DIP, DIP40,.6 | 40 | unknown | EAR99 | 8542.32.00.71 | |||||
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K3P4V1000D-GC10
Samsung Semiconductor
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Check for Price | No | Obsolete | 8.3886 Mbit | 16 | 512KX16 | 3.3 V | 100 ns | MASK ROM | CONFIGURABLE AS 512K X 16 | 8 | 1 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 30 µA | 40 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G44 | Not Qualified | e0 | 70 °C | 44 | PLASTIC/EPOXY | SOP | SOP44,.63 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 3.1 mm | 28.5 mm | 12.6 mm | SAMSUNG SEMICONDUCTOR INC | SOIC | SOP, SOP44,.63 | 44 | compliant | EAR99 | 8542.32.00.71 | ||||||
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NSC830N-3/B+
National Semiconductor Corporation
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Check for Price | No | Obsolete | 16.384 kbit | 8 | 2KX8 | 5 V | 400 ns | MASK ROM | 1 | 2000 | 2.048 k | ASYNCHRONOUS | PARALLEL | 10 µA | CMOS | COMMERCIAL | R-PDIP-T40 | Not Qualified | e0 | 70 °C | 40 | PLASTIC/EPOXY | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | NATIONAL SEMICONDUCTOR CORP | DIP, DIP40,.6 | unknown | EAR99 | 8542.32.00.71 | ||||||||||||||||
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UPD23C16000ALGX-XXX
Renesas Electronics Corporation
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Check for Price | No | Obsolete | 16.7772 Mbit | 16 | 1MX16 | 100 ns | MASK ROM | 8 | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 30 µA | 45 µA | 3.6 V | 2.7 V | CMOS | COMMERCIAL | R-PDSO-G44 | Not Qualified | e0 | 70 °C | -10 °C | 44 | PLASTIC/EPOXY | SOP | SOP44,.63 | RECTANGULAR | SMALL OUTLINE | YES | Tin/Lead (Sn/Pb) | GULL WING | 1.27 mm | DUAL | RENESAS ELECTRONICS CORP | unknown | EAR99 | 8542.32.00.71 | |||||||||||||
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KM23C64000AG-10
Samsung Semiconductor
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Check for Price | Obsolete | 67.1089 Mbit | 8 | 8MX8 | 5 V | 100 ns | MASK ROM | CONFIGURABLE AS 4M X 16 | 1 | 8000000 | 8.3886 M | ASYNCHRONOUS | PARALLEL | 70 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDSO-G44 | Not Qualified | 70 °C | 44 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 3.1 mm | 28.5 mm | 12.6 mm | SAMSUNG SEMICONDUCTOR INC | SOIC | SOP, | 44 | unknown | EAR99 | 8542.32.00.71 |