Parametric results for: Op Amp under Operational Amplifiers

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Package Code: FBGA Sorted By: Risk Rank
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LMC8101BP
Rochester Electronics LLC
Check for Price Yes No Active 7 mV 1.2 V/us 64 pA 1 OPERATIONAL AMPLIFIER 5 V -5 V CMOS -6 V 6 V INDUSTRIAL 840 S-PBGA-B8 e0 87 dB 1 85 °C -40 °C 260 40 8 PLASTIC/EPOXY FBGA SQUARE GRID ARRAY, FINE PITCH YES TIN LEAD BALL 500 µm BOTTOM 1.412 mm 1.412 mm ROCHESTER ELECTRONICS LLC BGA MICRO, SMD-8 8 unknown
LMC8101BPX
Rochester Electronics LLC
Check for Price No No Active 7 mV 1.2 V/us 64 pA 1 OPERATIONAL AMPLIFIER 5 V -5 V CMOS -6 V 6 V INDUSTRIAL 840 S-PBGA-B8 e0 87 dB 1 85 °C -40 °C 260 40 8 PLASTIC/EPOXY FBGA SQUARE GRID ARRAY, FINE PITCH YES TIN LEAD BALL 500 µm BOTTOM 1.412 mm 1.412 mm ROCHESTER ELECTRONICS LLC BGA MICRO, SMD-8 8 unknown
LM358BP
Rochester Electronics LLC
Check for Price Yes No Active 9 mV 0.1 V/us 50 nA 2 OPERATIONAL AMPLIFIER 5 V BIPOLAR 32 V COMMERCIAL 1000 S-PBGA-B8 e0 85 dB 1 70 °C 260 40 8 PLASTIC/EPOXY FBGA SQUARE GRID ARRAY, FINE PITCH YES TIN LEAD BALL 500 µm BOTTOM 1.285 mm 1.285 mm ROCHESTER ELECTRONICS LLC BGA MICRO, BUMP, SMD-8 8 unknown
LMC6035ITL/NOPB
Rochester Electronics LLC
Check for Price No Yes Active 5 mV 1.5 V/us 2 OPERATIONAL AMPLIFIER 2.7 V CMOS 16 V INDUSTRIAL 1400 R-PBGA-B8 e1 96 dB 1 85 °C -40 °C 260 40 8 PLASTIC/EPOXY FBGA RECTANGULAR GRID ARRAY, FINE PITCH YES TIN SILVER COPPER BALL 500 µm BOTTOM 1.717 mm 1.869 mm ROCHESTER ELECTRONICS LLC BGA MICRO, SMD-8 8 unknown
MAX44265EWT+
Analog Devices Inc
Check for Price Yes Active 5 mV 5.5 µA 1 OPERATIONAL AMPLIFIER BICMOS VOLTAGE-FEEDBACK 10 pA YES YES NO YES NO NO 6 V INDUSTRIAL 10000 NO R-PBGA-B6 Not Qualified e2 1 85 °C -40 °C 260 30 6 PLASTIC/EPOXY FBGA BGA6,2X3,16 RECTANGULAR GRID ARRAY, FINE PITCH YES Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) BALL 400 µm BOTTOM 6-WLCSP-N/A 6 6-WLCSP-N/A 2011-02-07 Analog Devices
LMC6035IBP
Rochester Electronics LLC
Check for Price Yes No Active 5 mV 1.5 V/us 90 pA 2 OPERATIONAL AMPLIFIER 2.7 V CMOS 16 V INDUSTRIAL 1400 S-PBGA-B8 e0 96 dB 1 85 °C -40 °C 260 40 8 PLASTIC/EPOXY FBGA SQUARE GRID ARRAY, FINE PITCH YES TIN LEAD BALL 500 µm BOTTOM 1.412 mm 1.412 mm ROCHESTER ELECTRONICS LLC BGA FBGA, 8 unknown
LM358TPX
National Semiconductor Corporation
Check for Price Yes Transferred 9 mV 50 nA 2 mA 2 OPERATIONAL AMPLIFIER 5 V BIPOLAR VOLTAGE-FEEDBACK 250 nA YES NO 32 V COMMERCIAL 1000 15000 S-PBGA-B8 Not Qualified e1 85 dB 1 70 °C 260 40 8 PLASTIC/EPOXY FBGA BGA8,3X3,20 SQUARE GRID ARRAY, FINE PITCH TAPE AND REEL YES TIN SILVER COPPER BALL 500 µm BOTTOM 1.285 mm 1.285 mm NATIONAL SEMICONDUCTOR CORP BGA FBGA, BGA8,3X3,20 8 compliant EAR99 8542.33.00.01
LM358TPX/NOPB
National Semiconductor Corporation
Check for Price Yes Transferred 9 mV 50 nA 2 mA 2 OPERATIONAL AMPLIFIER 5 V BIPOLAR VOLTAGE-FEEDBACK 250 nA YES NO 32 V COMMERCIAL 1000 15000 S-PBGA-B8 Not Qualified e1 85 dB 1 70 °C 260 40 8 PLASTIC/EPOXY FBGA BGA8,3X3,20 SQUARE GRID ARRAY, FINE PITCH TAPE AND REEL YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 500 µm BOTTOM 1.285 mm 1.285 mm NATIONAL SEMICONDUCTOR CORP BGA FBGA, BGA8,3X3,20 8 compliant EAR99 8542.33.00.01
LM358TP
National Semiconductor Corporation
Check for Price Yes Transferred 9 mV 50 nA 2 mA 2 OPERATIONAL AMPLIFIER 5 V BIPOLAR VOLTAGE-FEEDBACK 250 nA YES NO 32 V COMMERCIAL 1000 15000 S-PBGA-B8 Not Qualified e1 85 dB 1 70 °C 260 40 8 PLASTIC/EPOXY FBGA BGA8,3X3,20 SQUARE GRID ARRAY, FINE PITCH TAPE AND REEL YES TIN SILVER COPPER BALL 500 µm BOTTOM 1.285 mm 1.285 mm NATIONAL SEMICONDUCTOR CORP BGA FBGA, BGA8,3X3,20 8 compliant EAR99 8542.33.00.01
LM358TP/NOPB
National Semiconductor Corporation
Check for Price Yes Transferred 9 mV 50 nA 2 mA 2 OPERATIONAL AMPLIFIER 5 V BIPOLAR VOLTAGE-FEEDBACK 250 nA YES NO 32 V COMMERCIAL 1000 15000 S-PBGA-B8 Not Qualified e1 85 dB 1 70 °C 260 40 8 PLASTIC/EPOXY FBGA BGA8,3X3,20 SQUARE GRID ARRAY, FINE PITCH TAPE AND REEL YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 500 µm BOTTOM 1.285 mm 1.285 mm NATIONAL SEMICONDUCTOR CORP BGA LEAD FREE, MICRO, BUMP, SMD-8 8 compliant EAR99 8542.33.00.01