Parametric results for: Op Amp under Operational Amplifiers

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Package Code: VFBGA Sorted By: Risk Rank
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MAX9911EWT+T
Analog Devices Inc
Check for Price Yes Active 5 mV 0.1 V/us 30 pA 1 OPERATIONAL AMPLIFIER 1.8 V BICMOS 6 V INDUSTRIAL 200000 R-PBGA-B6 e2 80 dB 1 85 °C -40 °C 260 30 6 PLASTIC/EPOXY VFBGA RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) BALL 400 µm BOTTOM 690 µm 865 µm 1.27 mm 6-WLCSP-N/A 6 6-WLCSP-N/A 2005-08-05 Analog Devices
MAX9911EWT+
Analog Devices Inc
Check for Price Yes Active 1 mV 0.1 V/us 10 pA 5.5 µA 1 OPERATIONAL AMPLIFIER 1.8 V BICMOS VOLTAGE-FEEDBACK 10 pA YES YES NO YES NO NO 6 V INDUSTRIAL 200 10000 NO R-PBGA-B6 Not Qualified e2 80 dB 1 85 °C -40 °C 260 30 6 PLASTIC/EPOXY VFBGA BGA6,2X3,16 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) BALL 400 µm BOTTOM 690 µm 860 µm 1.27 mm 6-WLCSP-N/A 6 6-WLCSP-N/A 2005-08-05 Analog Devices
MAX9911EWT+
Maxim Integrated Products
Check for Price Yes Yes Transferred 1 mV 0.1 V/us 10 pA 5.5 µA 1 OPERATIONAL AMPLIFIER 1.8 V BICMOS VOLTAGE-FEEDBACK 10 pA YES YES NO YES NO NO 6 V INDUSTRIAL 200 10000 NO R-PBGA-B6 Not Qualified e2 80 dB 1 85 °C -40 °C 260 30 6 PLASTIC/EPOXY VFBGA BGA6,2X3,16 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES TIN SILVER COPPER NICKEL BALL 400 µm BOTTOM 690 µm 860 µm 1.27 mm BGA 6 MAXIM INTEGRATED PRODUCTS INC VFBGA, BGA6,2X3,16 compliant EAR99 8542.33.00.01