Parametric results for: Op Amp under Operational Amplifiers
Filter Your Search
1 - 4 of 4 results
|
Select parts from the table below to compare.
Compare
Compare
|
MAX4039EBL+T
Maxim Integrated Products
|
$1.6454 | Yes | Yes | Transferred | 8 mV | 4000 V/us | 100 pA | 2 | OPERATIONAL AMPLIFIER | 3 V | BICMOS | 4 V | INDUSTRIAL | 4 | S-PBGA-B9 | Not Qualified | e1 | 70 dB | 1 | 85 °C | -40 °C | 260 | 30 | 9 | PLASTIC/EPOXY | VFBGA | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 670 µm | 1.52 mm | 1.52 mm | MAXIM INTEGRATED PRODUCTS INC | BGA | 3 X 3 MM, UCSP-9 | 9 | compliant | EAR99 | 8542.33.00.01 | ||||||||||||||||||
|
|
MAX4039EBL+T
Analog Devices Inc
|
Check for Price | Yes | Active | 8 mV | 4000 V/us | 100 pA | 2 | OPERATIONAL AMPLIFIER | 3 V | BICMOS | 4 V | INDUSTRIAL | 4 | S-PBGA-B9 | Not Qualified | e1 | 70 dB | 1 | 85 °C | -40 °C | 260 | 30 | 9 | PLASTIC/EPOXY | VFBGA | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 500 µm | BOTTOM | 670 µm | 1.52 mm | 1.52 mm | ANALOG DEVICES INC | 9-WLCSP-N/A | 3 X 3 MM, UCSP-9 | 9 | compliant | 9-WLCSP-N/A | 2004-02-17 | Analog Devices | ||||||||||||||||||
|
|
MAX4039EBL+T
Rochester Electronics LLC
|
Check for Price | No | Yes | Active | 8 mV | 4000 V/us | 100 pA | 2 | OPERATIONAL AMPLIFIER | 3 V | BICMOS | 4 V | INDUSTRIAL | 4 | S-PBGA-B9 | 70 dB | 1 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 9 | PLASTIC/EPOXY | VFBGA | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | NOT SPECIFIED | BALL | 500 µm | BOTTOM | 670 µm | 1.52 mm | 1.52 mm | ROCHESTER ELECTRONICS LLC | BGA | 3 X 3 MM, UCSP-9 | 9 | unknown | ||||||||||||||||||||||
|
|
MAX4039EBL-T
Maxim Integrated Products
|
Check for Price | No | No | Transferred | 8 mV | 4000 V/us | 100 pA | 10.6 µA | 2 | OPERATIONAL AMPLIFIER | 3 V | BICMOS | VOLTAGE-FEEDBACK | 10 pA | YES | YES | NO | YES | NO | NO | 4 V | INDUSTRIAL | 4 | 4470 | NO | S-PBGA-B9 | Not Qualified | e0 | 70 dB | 1 | 85 °C | -40 °C | 9 | PLASTIC/EPOXY | VFBGA | BGA9,3X3,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | TAPE AND REEL | YES | TIN LEAD | BALL | 500 µm | BOTTOM | 670 µm | 1.52 mm | 1.52 mm | MAXIM INTEGRATED PRODUCTS INC | BGA | VFBGA, BGA9,3X3,20 | 9 | not_compliant | EAR99 | 8542.33.00.01 |