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5962-9755701HXX
Broadcom Limited
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Check for Price | No | Active | 100 MHz | 1 | ISOLATION AMPLIFIER | 5 V | 2.8 V | 5.5 V | MILITARY | 8.4 | 7.6 | R-CDSO-G8 | Not Qualified | 125 °C | -55 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | CERAMIC, METAL-SEALED COFIRED | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 2.54 mm | DUAL | 5.57 mm | 7.366 mm | 9.655 mm | BROADCOM INC | SOP, | compliant | EAR99 | 8542.33.00.01 | ||||||||||
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5962-9755701HPX
Hewlett Packard Co
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Check for Price | Transferred | 100 MHz | 1 | ISOLATION AMPLIFIER | 5 V | 5.5 V | MILITARY | 8.4 | 7.6 | R-PDIP-T8 | Not Qualified | 125 °C | -55 °C | 8 | PLASTIC/EPOXY | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | HEWLETT PACKARD CO | , | unknown | EAR99 | 8542.33.00.01 | DIP | 8 | |||||||||||||||||
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5962-9755701HPC
Hewlett Packard Co
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Check for Price | Transferred | 100 MHz | 1 | ISOLATION AMPLIFIER | 5 V | 5.5 V | MILITARY | 8.4 | 7.6 | R-PDIP-T8 | Not Qualified | e4 | 125 °C | -55 °C | 8 | PLASTIC/EPOXY | RECTANGULAR | IN-LINE | NO | GOLD | THROUGH-HOLE | DUAL | HEWLETT PACKARD CO | , | unknown | EAR99 | 8542.33.00.01 | DIP | 8 | |||||||||||||||
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5962-9755701HPC
Agilent Technologies Inc
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Check for Price | Transferred | 100 MHz | 15.5 mA | 1 | ISOLATION AMPLIFIER | 5 V | HYBRID | 2.8 V | 5.5 V | MILITARY | 8.4 | 7.6 | R-CDIP-T8 | Not Qualified | e4 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 8 | CERAMIC, METAL-SEALED COFIRED | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | GOLD | THROUGH-HOLE | 2.54 mm | DUAL | 4.32 mm | 7.62 mm | 9.655 mm | AGILENT TECHNOLOGIES INC | DIP, DIP8,.3 | unknown | EAR99 | 8542.33.00.01 | DIP | 8 | |||||
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5962-9755701HPX
Agilent Technologies Inc
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Check for Price | Transferred | 100 MHz | 1 | ISOLATION AMPLIFIER | 5 V | 2.8 V | 5.5 V | MILITARY | 8.4 | 7.6 | R-CDIP-T8 | Not Qualified | 125 °C | -55 °C | 8 | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 4.32 mm | 7.62 mm | 9.655 mm | AGILENT TECHNOLOGIES INC | DIP, | unknown | EAR99 | 8542.33.00.01 | DIP | 8 | |||||||||||
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5962-9755701HPA
Hewlett Packard Co
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Check for Price | Transferred | 100 MHz | 1 | ISOLATION AMPLIFIER | 5 V | 5.5 V | MILITARY | 8.4 | 7.6 | R-PDIP-T8 | Not Qualified | e0 | 125 °C | -55 °C | 8 | PLASTIC/EPOXY | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | DUAL | HEWLETT PACKARD CO | , | unknown | EAR99 | 8542.33.00.01 | DIP | 8 | |||||||||||||||
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5962-9755701HYC
Agilent Technologies Inc
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Check for Price | Transferred | 100 MHz | 15.5 mA | 1 | ISOLATION AMPLIFIER | 5 V | HYBRID | 2.8 V | 5.5 V | MILITARY | 8.4 | 7.6 | R-CDSO-B8 | Not Qualified | e4 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 8 | CERAMIC, METAL-SEALED COFIRED | SOI | SMDIP8,.3 | RECTANGULAR | SMALL OUTLINE | YES | GOLD | BUTT | 2.54 mm | DUAL | 4.32 mm | 7.366 mm | 9.655 mm | AGILENT TECHNOLOGIES INC | SOI, SMDIP8,.3 | unknown | EAR99 | 8542.33.00.01 | SOIC | 8 | |||||
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5962-9755701HYC
Hewlett Packard Co
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Check for Price | Transferred | 100 MHz | 1 | ISOLATION AMPLIFIER | 5 V | 5.5 V | MILITARY | 8.4 | 7.6 | R-PDIP-T8 | Not Qualified | e4 | 125 °C | -55 °C | 8 | PLASTIC/EPOXY | RECTANGULAR | IN-LINE | NO | GOLD | THROUGH-HOLE | DUAL | HEWLETT PACKARD CO | , | unknown | EAR99 | 8542.33.00.01 | DIP | 8 | |||||||||||||||
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5962-9755701HYA
Hewlett Packard Co
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Check for Price | Transferred | 100 MHz | 1 | ISOLATION AMPLIFIER | 5 V | 5.5 V | MILITARY | 8.4 | 7.6 | R-PDIP-T8 | Not Qualified | e0 | 125 °C | -55 °C | 8 | PLASTIC/EPOXY | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | DUAL | HEWLETT PACKARD CO | , | unknown | EAR99 | 8542.33.00.01 | DIP | 8 | |||||||||||||||
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5962-9755701HYX
Agilent Technologies Inc
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Check for Price | Transferred | 100 MHz | 1 | ISOLATION AMPLIFIER | 5 V | 2.8 V | 5.5 V | MILITARY | 8.4 | 7.6 | R-CDSO-B8 | Not Qualified | 125 °C | -55 °C | 8 | CERAMIC, METAL-SEALED COFIRED | SOI | RECTANGULAR | SMALL OUTLINE | YES | BUTT | 2.54 mm | DUAL | 4.32 mm | 7.366 mm | 9.655 mm | AGILENT TECHNOLOGIES INC | SOI, | unknown | EAR99 | 8542.33.00.01 | SOIC | 8 |