Parametric results for: Op Amp under Comparators

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Package Code: BGA Sorted By: Risk Rank
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MAX9063EBS+TG45
Maxim Integrated Products
$0.8584 Yes Transferred 15 nA 1.1 µA 15 µs 1 COMPARATOR 3.3 V BICMOS OPEN-DRAIN 6 V INDUSTRIAL S-PBGA-B4 Not Qualified e2 1 85 °C -40 °C 260 30 4 PLASTIC/EPOXY BGA BGA4,2X2,20 SQUARE GRID ARRAY YES TIN SILVER COPPER NICKEL BALL 500 µm BOTTOM MAXIM INTEGRATED PRODUCTS INC UCSP-4 compliant EAR99 8542.39.00.01
MAX9061EBS+TG45
Maxim Integrated Products
$0.5719 Yes Transferred 9 mV 100 nA 25 µs 1 COMPARATOR 1.8 V BICMOS OPEN-DRAIN 6 V INDUSTRIAL S-PBGA-B4 Not Qualified e2 1 85 °C -40 °C 260 30 4 PLASTIC/EPOXY BGA BGA4,2X2,20 SQUARE GRID ARRAY YES TIN SILVER COPPER NICKEL BALL 500 µm BOTTOM MAXIM INTEGRATED PRODUCTS INC BGA, BGA4,2X2,20 compliant EAR99 8542.39.00.01
MAX9064EBS+TG45
Maxim Integrated Products
$0.8764 Yes Transferred 15 nA 1.1 µA 15 µs 1 COMPARATOR 3.3 V BICMOS PUSH-PULL 6 V INDUSTRIAL S-PBGA-B4 Not Qualified e2 1 85 °C -40 °C 260 30 4 PLASTIC/EPOXY BGA BGA4,2X2,20 SQUARE GRID ARRAY YES TIN SILVER COPPER NICKEL BALL 500 µm BOTTOM MAXIM INTEGRATED PRODUCTS INC BGA, BGA4,2X2,20 compliant EAR99 8542.39.00.01
MAX9060EBS+TG45
Maxim Integrated Products
$0.8412 Yes Transferred 9 mV 100 nA 25 µs 1 COMPARATOR 1.8 V BICMOS OPEN-DRAIN 6 V INDUSTRIAL S-PBGA-B4 Not Qualified e2 1 85 °C -40 °C 260 30 4 PLASTIC/EPOXY BGA BGA4,2X2,20 SQUARE GRID ARRAY YES TIN SILVER COPPER NICKEL BALL 500 µm BOTTOM MAXIM INTEGRATED PRODUCTS INC UCSP-4 compliant EAR99 8542.39.00.01
MAX9063EBS+TG45
Analog Devices Inc
Check for Price Yes Active 9 mV 15 nA 1.1 µA 15 µs 1 COMPARATOR 3.3 V BICMOS OPEN-DRAIN 6 V INDUSTRIAL S-PBGA-B4 Not Qualified e2 1 85 °C -40 °C 260 30 4 PLASTIC/EPOXY BGA BGA4,2X2,20 SQUARE GRID ARRAY YES Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) BALL 500 µm BOTTOM ANALOG DEVICES INC UCSP-4 compliant 4-WLCSP-N/A 4 4-WLCSP-N/A 2008-05-07 Analog Devices
MAX9060EBS+TG45
Analog Devices Inc
Check for Price Yes Active 9 mV 100 nA 25 µs 1 COMPARATOR 1.8 V BICMOS OPEN-DRAIN 6 V INDUSTRIAL S-PBGA-B4 Not Qualified e2 1 85 °C -40 °C 260 30 4 PLASTIC/EPOXY BGA BGA4,2X2,20 SQUARE GRID ARRAY YES Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) BALL 500 µm BOTTOM ANALOG DEVICES INC UCSP-4 compliant 4-WLCSP-N/A 4 4-WLCSP-N/A 2008-05-07 Analog Devices
MAX9061EBS+TG45
Analog Devices Inc
Check for Price Yes Active 9 mV 100 nA 25 µs 1 COMPARATOR 1.8 V BICMOS OPEN-DRAIN 6 V INDUSTRIAL S-PBGA-B4 Not Qualified e2 1 85 °C -40 °C 260 30 4 PLASTIC/EPOXY BGA BGA4,2X2,20 SQUARE GRID ARRAY YES Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) BALL 500 µm BOTTOM 4-WLCSP-N/A 4 4-WLCSP-N/A 2008-05-07 Analog Devices
MAX9064EBS+TG45
Analog Devices Inc
Check for Price Yes Active 9 mV 15 nA 1.1 µA 15 µs 1 COMPARATOR 3.3 V BICMOS PUSH-PULL 6 V INDUSTRIAL S-PBGA-B4 Not Qualified e2 1 85 °C -40 °C 260 30 4 PLASTIC/EPOXY BGA BGA4,2X2,20 SQUARE GRID ARRAY YES Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) BALL 500 µm BOTTOM 4-WLCSP-N/A 4 4-WLCSP-N/A 2008-05-07 Analog Devices
MAX972EBL-T
Rochester Electronics LLC
Check for Price No Active 10 mV 300 µs 2 COMPARATOR 3 V OPEN-DRAIN 12 V INDUSTRIAL S-XBGA-B8 COMMERCIAL 1 85 °C -40 °C 245 NOT SPECIFIED 8 UNSPECIFIED BGA SQUARE GRID ARRAY YES NOT SPECIFIED BALL BOTTOM ROCHESTER ELECTRONICS LLC UCSP-8 unknown BGA 8
MAX972EBL-T
Maxim Integrated Products
Check for Price No No Transferred 10 mV 3.8 µA 300 µs 2 COMPARATOR 3 V OPEN-DRAIN 12 V INDUSTRIAL S-XBGA-B8 Not Qualified e0 1 85 °C -40 °C 8 UNSPECIFIED BGA BGA8,3X3,20 SQUARE GRID ARRAY YES TIN LEAD BALL 500 µm BOTTOM MAXIM INTEGRATED PRODUCTS INC BGA, BGA8,3X3,20 not_compliant EAR99 8542.39.00.01 BGA 8