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LMH6321MRX/NOPB
Texas Instruments
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$2.9955 | Yes | Yes | Active | 35 mV | 110 MHz | 1800 V/us | 17 µA | 14.5 mA | 1 | BUFFER | 15 V | -15 V | 15 nA | -18 V | 300 mA | 18 V | AUTOMOTIVE | 110000 | R-PDSO-G8 | Not Qualified | e3 | 3 | 125 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | HLSOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE | TR | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 1.68 mm | 3.94 mm | 4.93 mm | TEXAS INSTRUMENTS INC | SOIC | HLSOP, SOP8,.25 | 8 | compliant | EAR99 | 8542.33.00.01 | Texas Instruments | ||
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LMH6321TSX/NOPB
Texas Instruments
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$3.2125 | Yes | No | Active | 35 mV | 110 MHz | 1800 V/us | 17 µA | 14.5 mA | 1 | BUFFER | 15 V | -15 V | 15 nA | -18 V | 300 mA | 18 V | AUTOMOTIVE | 110000 | R-PSSO-G7 | Not Qualified | e3 | 3 | 125 °C | -40 °C | 245 | 30 | 7 | PLASTIC/EPOXY | TO-263 | SMSIP7H,.55,50TB | RECTANGULAR | SMALL OUTLINE | TR | YES | MATTE TIN | GULL WING | 1.27 mm | SINGLE | 4.79 mm | 8.64 mm | 10.16 mm | TEXAS INSTRUMENTS INC | D2PAK | TO-263, 7 PIN | 4 | not_compliant | EAR99 | 8542.33.00.01 | Texas Instruments | ||
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LMH6321MR
National Semiconductor Corporation
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$4.2497 | No | Transferred | 52 mV | 110 MHz | 2900 V/us | 17 µA | 20.5 mA | 1 | BUFFER | 15 V | -15 V | 17 µA | -18 V | 300 mA | 18 V | AUTOMOTIVE | R-PDSO-G8 | Not Qualified | e0 | 3 | 125 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | HLSOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | GULL WING | 1.27 mm | DUAL | 1.68 mm | 3.94 mm | 4.93 mm | NATIONAL SEMICONDUCTOR CORP | SOIC | PSOP-8 | 8 | not_compliant | EAR99 | 8542.33.00.01 | ||||||
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LMH6321MR/NOPB
Texas Instruments
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$4.3999 | Yes | Yes | Obsolete | 35 mV | 110 MHz | 1800 V/us | 17 µA | 14.5 mA | 1 | BUFFER | 15 V | -15 V | 15 nA | -18 V | 300 mA | 18 V | AUTOMOTIVE | 110000 | R-PDSO-G8 | Not Qualified | e3 | 3 | 125 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | HLSOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE | TUBE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 1.68 mm | 3.94 mm | 4.93 mm | TEXAS INSTRUMENTS INC | SOIC | HLSOP, SOP8,.25 | 8 | compliant | EAR99 | 8542.33.00.01 | Texas Instruments | ||
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LMH6321TS/NOPB
Texas Instruments
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$4.4502 | Yes | No | Lifetime Buy | 35 mV | 110 MHz | 1800 V/us | 17 µA | 14.5 mA | 1 | BUFFER | 15 V | -15 V | 15 nA | -18 V | 300 mA | 18 V | AUTOMOTIVE | 110000 | R-PSSO-G7 | Not Qualified | e3 | 3 | 125 °C | -40 °C | 245 | 30 | 7 | PLASTIC/EPOXY | TO-263 | SMSIP7H,.55,50TB | RECTANGULAR | SMALL OUTLINE | TUBE | YES | MATTE TIN | GULL WING | 1.27 mm | SINGLE | 4.79 mm | 8.64 mm | 10.16 mm | TEXAS INSTRUMENTS INC | D2PAK | TO-263, 7 PIN | 4 | not_compliant | EAR99 | 8542.33.00.01 | Texas Instruments | ||
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LMH6321TS/NOPB
National Semiconductor Corporation
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Check for Price | Yes | Transferred | 52 mV | 110 MHz | 2900 V/us | 17 µA | 20.5 mA | 1 | BUFFER | 15 V | -15 V | 17 µA | -18 V | 300 mA | 18 V | AUTOMOTIVE | R-PSSO-G7 | Not Qualified | e3 | 3 | 125 °C | -40 °C | 245 | 30 | 7 | PLASTIC/EPOXY | TO-263 | SMSIP7H,.55,50TB | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | SINGLE | 4.79 mm | 8.64 mm | 10.16 mm | NATIONAL SEMICONDUCTOR CORP | D2PAK | TO-263, 7 PIN | 7 | not_compliant | EAR99 | 8542.33.00.01 | ||||||
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LMH6321MRX/NOPB
National Semiconductor Corporation
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Check for Price | Yes | Transferred | 52 mV | 110 MHz | 2900 V/us | 17 µA | 20.5 mA | 1 | BUFFER | 15 V | -15 V | 17 µA | -18 V | 300 mA | 18 V | AUTOMOTIVE | R-PDSO-G8 | Not Qualified | e3 | 3 | 125 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | HLSOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 1.68 mm | 3.94 mm | 4.93 mm | NATIONAL SEMICONDUCTOR CORP | SOIC | HLSOP, SOP8,.25 | 8 | compliant | EAR99 | 8542.33.00.01 | ||||||
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LMH6321MR/NOPB
National Semiconductor Corporation
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Check for Price | Yes | Transferred | 52 mV | 110 MHz | 2900 V/us | 17 µA | 20.5 mA | 1 | BUFFER | 15 V | -15 V | 17 µA | -18 V | 300 mA | 18 V | AUTOMOTIVE | R-PDSO-G8 | Not Qualified | e3 | 3 | 125 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | HLSOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 1.68 mm | 3.94 mm | 4.93 mm | NATIONAL SEMICONDUCTOR CORP | SOIC | HLSOP, SOP8,.25 | 8 | compliant | EAR99 | 8542.33.00.01 | ||||||
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LMH6321TSX/NOPB
National Semiconductor Corporation
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Check for Price | Yes | Transferred | 52 mV | 110 MHz | 2900 V/us | 17 µA | 20.5 mA | 1 | BUFFER | 15 V | -15 V | 17 µA | -18 V | 300 mA | 18 V | AUTOMOTIVE | R-PSSO-G7 | Not Qualified | e3 | 3 | 125 °C | -40 °C | 245 | 30 | 7 | PLASTIC/EPOXY | TO-263 | SMSIP7H,.55,50TB | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | SINGLE | 4.79 mm | 8.64 mm | 10.16 mm | NATIONAL SEMICONDUCTOR CORP | D2PAK | TO-263, 7 PIN | 7 | not_compliant | EAR99 | 8542.33.00.01 | ||||||
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LMH6321TS
National Semiconductor Corporation
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Check for Price | No | Transferred | 52 mV | 110 MHz | 2900 V/us | 17 µA | 20.5 mA | 1 | BUFFER | 15 V | -15 V | 17 µA | -18 V | 300 mA | 18 V | AUTOMOTIVE | R-PSSO-G7 | Not Qualified | e0 | 3 | 125 °C | -40 °C | 235 | 30 | 7 | PLASTIC/EPOXY | TO-263 | SMSIP7H,.55,50TB | RECTANGULAR | SMALL OUTLINE | YES | Tin/Lead (Sn/Pb) | GULL WING | 1.27 mm | SINGLE | 4.79 mm | 8.64 mm | 10.16 mm | NATIONAL SEMICONDUCTOR CORP | D2PAK | TO-263, 7 PIN | 7 | not_compliant | EAR99 | 8542.33.00.01 |