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Parametric results for: Op Amp under Buffer Amplifiers

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EL5323CRZ
 Renesas Electronics Corporation 		Check for Price Yes Active 12 mV 12 MHz 15 V/us 50 nA 10 BUFFER 5 V -5 V CMOS -9 V 9 V INDUSTRIAL R-PDSO-G24 e3 85 °C -40 °C 24 PLASTIC/EPOXY TSSOP RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 1.2 mm 4.4 mm 7.8 mm RENESAS ELECTRONICS CORP TSSOP-24 compliant EAR99 8542.33.00.01
EL5323CLZ
 Renesas Electronics Corporation 		Check for Price Yes Active 12 mV 12 MHz 15 V/us 50 nA 10 BUFFER 5 V -5 V CMOS -9 V 9 V INDUSTRIAL R-PQCC-N24 e3 85 °C -40 °C 24 PLASTIC/EPOXY HVQCCN RECTANGULAR CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES MATTE TIN NO LEAD 500 µm QUAD 1 mm 4 mm 5 mm RENESAS ELECTRONICS CORP QFN-24 compliant EAR99 8542.33.00.01
EL5323CRZ-T7
 Renesas Electronics Corporation 		Check for Price Yes Active 12 mV 12 MHz 15 V/us 50 nA 10 BUFFER 5 V -5 V CMOS -9 V 9 V INDUSTRIAL R-PDSO-G24 e3 85 °C -40 °C 24 PLASTIC/EPOXY TSSOP RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 1.2 mm 4.4 mm 7.8 mm RENESAS ELECTRONICS CORP TSSOP, compliant EAR99 8542.33.00.01
EL5323CLZ-T7
 Renesas Electronics Corporation 		Check for Price Yes Active 12 mV 12 MHz 15 V/us 50 nA 10 BUFFER 5 V -5 V CMOS -9 V 9 V INDUSTRIAL R-PQCC-N24 e3 85 °C -40 °C 24 PLASTIC/EPOXY HVQCCN RECTANGULAR CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES MATTE TIN NO LEAD 500 µm QUAD 1 mm 4 mm 5 mm RENESAS ELECTRONICS CORP HVQCCN, compliant EAR99 8542.33.00.01
EL5323CLZ-T13
 Renesas Electronics Corporation 		Check for Price Yes Active 12 mV 12 MHz 15 V/us 50 nA 10 BUFFER 5 V -5 V CMOS -9 V 9 V INDUSTRIAL R-PQCC-N24 e3 85 °C -40 °C 24 PLASTIC/EPOXY HVQCCN RECTANGULAR CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES MATTE TIN NO LEAD 500 µm QUAD 1 mm 4 mm 5 mm RENESAS ELECTRONICS CORP HVQCCN, compliant EAR99 8542.33.00.01
EL5323CRZ-T13
 Renesas Electronics Corporation 		Check for Price Yes Active 12 mV 12 MHz 15 V/us 50 nA 10 BUFFER 5 V -5 V CMOS -9 V 9 V INDUSTRIAL R-PDSO-G24 e3 85 °C -40 °C 24 PLASTIC/EPOXY TSSOP RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 1.2 mm 4.4 mm 7.8 mm RENESAS ELECTRONICS CORP TSSOP, compliant EAR99 8542.33.00.01
EL5323CL
 Intersil Corporation 		Check for Price No Transferred 12 mV 12 MHz 15 V/us 50 nA 10 BUFFER 5 V -5 V -9 V 9 V INDUSTRIAL R-XQCC-N24 Not Qualified 85 °C -40 °C 24 UNSPECIFIED RECTANGULAR CHIP CARRIER YES NO LEAD QUAD INTERSIL CORP QFN-24 not_compliant EAR99 8542.33.00.01 QFN 24
EL5323CR
 Renesas Electronics Corporation 		Check for Price Obsolete 12 mV 12 MHz 15 V/us 50 nA 10 BUFFER 5 V -5 V CMOS -9 V 9 V INDUSTRIAL R-PDSO-G24 85 °C -40 °C 24 PLASTIC/EPOXY TSSOP RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES GULL WING 650 µm DUAL 1.2 mm 4.4 mm 7.8 mm RENESAS ELECTRONICS CORP TSSOP, compliant EAR99 8542.33.00.01
EL5323CL-T7
 Renesas Electronics Corporation 		Check for Price Obsolete 12 mV 12 MHz 15 V/us 50 nA 10 BUFFER 5 V -5 V CMOS -9 V 9 V INDUSTRIAL R-PQCC-N24 85 °C -40 °C 24 PLASTIC/EPOXY HVQCCN RECTANGULAR CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES NO LEAD 500 µm QUAD 1 mm 4 mm 5 mm RENESAS ELECTRONICS CORP HVQCCN, compliant EAR99 8542.33.00.01
EL5323CR-T13
 Renesas Electronics Corporation 		Check for Price Obsolete 12 mV 12 MHz 15 V/us 50 nA 10 BUFFER 5 V -5 V CMOS -9 V 9 V INDUSTRIAL R-PDSO-G24 85 °C -40 °C 24 PLASTIC/EPOXY TSSOP RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES GULL WING 650 µm DUAL 1.2 mm 4.4 mm 7.8 mm RENESAS ELECTRONICS CORP TSSOP, compliant EAR99 8542.33.00.01
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