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Package Code: HBGA uPs/uCs/Peripheral ICs Type: MICROCONTROLLER Sorted By: Speed
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MPC5554MVR80R2
 Freescale Semiconductor 		Check for Price Yes Transferred 32 80 MHz 2097152 65536 32 24 20 MHz YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e1 3 125 °C -40 °C 260 40 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG TIN SILVER COPPER BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm FREESCALE SEMICONDUCTOR INC BGA HBGA, BGA416,26X26,40 416 unknown 3A991 8542.31.00.01
935319212557
 NXP Semiconductors 		Check for Price Not Recommended 32 80 MHz 2097152 65536 32 24 20 MHz 220 YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e1 3 125 °C -40 °C 260 40 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS unknown 8542.31.00.01
MPC5566MZP80R
 NXP Semiconductors 		Check for Price No Active 32 80 MHz 3145728 131072 32 24 20 MHz 256 YES 1.5 V MICROCONTROLLER CMOS ADC 40-CH IS AVAILABLE NO YES YES 8 YES FLASH 820 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified 125 °C -40 °C 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS TEBGA-416 unknown 8542.31.00.01
MPC5566MVR80R
 NXP Semiconductors 		Check for Price Yes Active 32 80 MHz 3145728 131072 32 24 20 MHz 256 YES 1.5 V MICROCONTROLLER CMOS ADC 40-CH IS AVAILABLE NO YES YES 8 YES FLASH 820 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified 125 °C -40 °C 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS TEBGA-416 compliant 8542.31.00.01
MPC5554MVR80
 Freescale Semiconductor 		Check for Price Yes Yes Transferred 32 80 MHz 2097152 65536 32 24 20 MHz YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e1 3 125 °C -40 °C 260 40 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG TIN SILVER COPPER BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm FREESCALE SEMICONDUCTOR INC BGA 27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, TEPBGA-416 416 compliant 3A991.A.2 8542.31.00.01
935322744518
 NXP Semiconductors 		Check for Price Not Recommended 32 80 MHz 2097152 65536 32 24 20 MHz YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 600 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e0 3 125 °C -40 °C 245 30 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS unknown 8542.31.00.01
935322744557
 NXP Semiconductors 		Check for Price Not Recommended 32 80 MHz 2097152 65536 32 24 20 MHz 220 YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 600 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e0 3 125 °C -40 °C 245 30 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS unknown 8542.31.00.01
MPC5554MZP80R2
 Freescale Semiconductor 		Check for Price No No Transferred 32 80 MHz 2097152 65536 32 24 20 MHz YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 600 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e0 3 125 °C -40 °C 245 30 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG TIN LEAD SILVER BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm FREESCALE SEMICONDUCTOR INC BGA 27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, TEBGA-416 416 not_compliant 3A991.A.2 8542.31.00.01
MPC5554MZP80
 NXP Semiconductors 		$57.2454 No Not Recommended 32 80 MHz 2097152 65536 32 24 20 MHz 220 YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 600 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e0 3 125 °C -40 °C 245 30 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS TEPBGA-416 unknown 3A991.A.2 8542.31.00.01 NXP
MPC5554MVR80
 NXP Semiconductors 		Check for Price Yes Not Recommended 32 80 MHz 2097152 65536 32 24 20 MHz 220 YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e1 3 125 °C -40 °C 260 40 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS TEPBGA-416 compliant 3A991.A.2 8542.31.00.01
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