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W741E204
Winbond Electronics Corp
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Check for Price | No | Obsolete | 4 | 4.19 MHz | 2048 | 64 | 4.19 MHz | 12 | YES | MICROCONTROLLER | CMOS | NO | NO | NO | NO | FLASH | 65 µA | 5.5 V | 2.4 V | COMMERCIAL | R-PDSO-G20 | Not Qualified | e0 | 70 °C | 20 | PLASTIC/EPOXY | SOP | SOP20,.4 | RECTANGULAR | SMALL OUTLINE | TIN LEAD | GULL WING | 1.27 mm | DUAL | WINBOND ELECTRONICS CORP | SOIC | 0.300 INCH, SOP-20 | 20 | not_compliant | 8542.31.00.01 | |||||
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F80C52-1
Temic Semiconductors
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Check for Price | No | Obsolete | 8 | 16 MHz | 8192 | 256 | 8051 | YES | 5 V | CMOS | MROM | 27 mA | COMMERCIAL | S-PQFP-G44 | Not Qualified | e0 | 70 °C | 44 | PLASTIC/EPOXY | QFP | QFP44,.5SQ,32 | SQUARE | FLATPACK | Tin/Lead (Sn/Pb) | GULL WING | 800 µm | QUAD | TEMIC SEMICONDUCTORS | unknown | 8542.31.00.01 | |||||||||||||||
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TS83C51RC2-MIEB
Atmel Corporation
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Check for Price | No | Obsolete | 8 | 40 MHz | 32768 | 512 | 8051 | YES | 5 V | CMOS | MROM | 27 mA | INDUSTRIAL | S-PQFP-G44 | Not Qualified | e0 | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | QFP | QFP44,.5SQ,32 | SQUARE | FLATPACK | Tin/Lead (Sn/Pb) | GULL WING | 800 µm | QUAD | ATMEL CORP | QFP | QFP, QFP44,.5SQ,32 | 44 | compliant | 8542.31.00.01 | |||||||||||
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M50747H-XXXSP
Mitsubishi Electric
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Check for Price | No | Obsolete | 8 | 3 MHz | 8192 | 256 | MELPS740 | NO | 5 V | CMOS | MROM | 18 mA | COMMERCIAL | R-PDIP-T64 | Not Qualified | e0 | 70 °C | -10 °C | 64 | PLASTIC/EPOXY | SDIP | SDIP64,.75 | RECTANGULAR | IN-LINE, SHRINK PITCH | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 1.78 mm | DUAL | MITSUBISHI ELECTRIC CORP | SDIP, SDIP64,.75 | unknown | 8542.31.00.01 | |||||||||||||
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MC68HC11P2FN1
Motorola Semiconductor Products
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Check for Price | No | Obsolete | 8 | 4 MHz | 24576 | 1024 | 6800 | YES | CMOS | MROM | INDUSTRIAL | S-PQCC-J84 | Not Qualified | e0 | 85 °C | -40 °C | 84 | PLASTIC/EPOXY | QCCJ | LDCC84,1.2SQ | SQUARE | CHIP CARRIER | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | MOTOROLA INC | unknown | 8542.31.00.01 | ||||||||||||||||
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UPD789104CT-XXX
Renesas Electronics Corporation
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Check for Price | No | Obsolete | 8 | 5 MHz | 8192 | 256 | UPD78K0 | NO | CMOS | MROM | 18.3 mA | INDUSTRIAL | R-PDIP-T28 | Not Qualified | e0 | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | SDIP | SDIP28,.4 | RECTANGULAR | IN-LINE, SHRINK PITCH | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 1.78 mm | DUAL | RENESAS ELECTRONICS CORP | unknown | 8542.31.00.01 | |||||||||||||||
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MC68HC05B8P
Motorola Semiconductor Products
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Check for Price | No | Obsolete | 8 | 2.1 MHz | 7504 | 176 | 6805 | NO | CMOS | MROM | 9 mA | COMMERCIAL | R-PDIP-T48 | Not Qualified | e0 | 70 °C | 48 | PLASTIC/EPOXY | DIP | DIP48,.6 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | MOTOROLA INC | unknown | 8542.31.00.01 | ||||||||||||||||
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MAF80A40HLWP
Philips Semiconductors
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Check for Price | No | Obsolete | 8 | 10 MHz | 256 | 8048 | YES | 5 V | MOS | 120 mA | INDUSTRIAL | S-PQCC-J44 | Not Qualified | e0 | 110 °C | -40 °C | 44 | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | PHILIPS SEMICONDUCTORS | QCCJ, LDCC44,.7SQ | unknown | 8542.31.00.01 | |||||||||||||||
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MC68HC05F5P
National Semiconductor Corporation
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Check for Price | No | Obsolete | 8 | 2 MHz | 5632 | 224 | 6805 | NO | 5 V | CMOS | MROM | COMMERCIAL | R-PDIP-T40 | Not Qualified | e0 | 70 °C | 40 | PLASTIC/EPOXY | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | NATIONAL SEMICONDUCTOR CORP | DIP, DIP40,.6 | unknown | 8542.31.00.01 | |||||||||||||||
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MC6803GDS
Freescale Semiconductor
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Check for Price | No | Obsolete | 8 | 1 MHz | 128 | 6800 | NO | 5 V | MOS | COMMERCIAL | R-PDIP-T40 | e0 | 70 °C | 40 | PLASTIC/EPOXY | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | MOTOROLA SEMICONDUCTOR PRODUCTS | DIP, DIP40,.6 | unknown | 8542.31.00.01 |