Findchips: Parametric Search Results for Microcontroller

Parametric results for: Microcontroller under Microcontrollers

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		935309596557 NXP Semiconductors
		MPC5554AZP132R2 NXP Semiconductors
		SPC5554MVR132 Freescale Semiconductor
		MPC5554AZP132 Freescale Semiconductor
		MPC5554MZP112 NXP Semiconductors
		935322743557 NXP Semiconductors
		935319212557 NXP Semiconductors
		TC1796256F150EBEKXUMA2 Infineon Technologies AG
		935309507557 NXP Semiconductors
		MPC5554MVR112 Freescale Semiconductor

				Most Relevant										Technical													Compliance			Operating Conditions						Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	ROM (words)	RAM (bytes)	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Number of I/O Lines	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Additional Feature	DAC Channels	DMA Channels	Has ADC	On Chip Program ROM Width	PWM Channels	ROM Programmability	Supply Current-Max	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Screening Level	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Reach Compliance Code	HTS Code	Package Description	ECCN Code	Samacsys Manufacturer	Part Package Code	Pin Count

Check for Price

Not Recommended

132 MHz

2097152

65536

20 MHz

220

YES

1.5 V

MICROCONTROLLER

CMOS

IT ALSO REQUIRES 3.3V SUPPLY

YES

FLASH

600 mA

1.65 V

1.35 V

AUTOMOTIVE

S-PBGA-B416

Not Qualified

125 °C

-40 °C

245

416

PLASTIC/EPOXY

HBGA

BGA416,26X26,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Lead/Silver (Sn/Pb/Ag)

BALL

1 mm

BOTTOM

2.55 mm

27 mm

NXP SEMICONDUCTORS

unknown

8542.31.00.01

Check for Price

Not Recommended

132 MHz

2097152

65536

20 MHz

YES

1.5 V

MICROCONTROLLER

CMOS

IT ALSO REQUIRES 3.3V SUPPLY

YES

FLASH

1.65 V

1.35 V

MILITARY

S-PBGA-B416

Not Qualified

125 °C

-55 °C

416

PLASTIC/EPOXY

HBGA

BGA416,26X26,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

TIN LEAD SILVER

BALL

1 mm

BOTTOM

2.55 mm

27 mm

NXP SEMICONDUCTORS

unknown

8542.31.00.01

27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, TEBGA-416

3A001.A.2.C

Check for Price

Yes

Transferred

132 MHz

2097152

65536

20 MHz

256

YES

1.5 V

MICROCONTROLLER

CMOS

ALSO OPERATES AT 3.3 V

YES

FLASH

875 mA

1.65 V

1.35 V

AUTOMOTIVE

S-PBGA-B416

Not Qualified

125 °C

-40 °C

260

AEC-Q100

416

PLASTIC/EPOXY

HBGA

BGA416,26X26,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

2.55 mm

27 mm

FREESCALE SEMICONDUCTOR INC

compliant

27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, MS-034AAL-1, TEPBGA-416

NXP

Check for Price

Transferred

132 MHz

2097152

65536

20 MHz

YES

1.5 V

MICROCONTROLLER

CMOS

IT ALSO REQUIRES 3.3V SUPPLY

YES

FLASH

600 mA

1.65 V

1.35 V

MILITARY

S-PBGA-B416

Not Qualified

125 °C

-55 °C

245

416

PLASTIC/EPOXY

HBGA

BGA416,26X26,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

TIN LEAD SILVER

BALL

1 mm

BOTTOM

2.55 mm

27 mm

FREESCALE SEMICONDUCTOR INC

not_compliant

8542.31.00.01

27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, TEBGA-416

3A991.A.2

NXP

BGA

416

$58.2867

Not Recommended

112 MHz

2097152

65536

20 MHz

220

YES

1.5 V

MICROCONTROLLER

CMOS

IT ALSO REQUIRES 3.3V SUPPLY

YES

FLASH

600 mA

1.65 V

1.35 V

AUTOMOTIVE

S-PBGA-B416

Not Qualified

125 °C

-40 °C

245

416

PLASTIC/EPOXY

HBGA

BGA416,26X26,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Lead (Sn/Pb)

BALL

1 mm

BOTTOM

2.55 mm

27 mm

NXP SEMICONDUCTORS

unknown

8542.31.00.01

TEPBGA-416

3A991.A.2

NXP

Check for Price

Not Recommended

132 MHz

2097152

65536

20 MHz

220

YES

1.5 V

MICROCONTROLLER

CMOS

IT ALSO REQUIRES 3.3V SUPPLY

YES

FLASH

600 mA

1.65 V

1.35 V

AUTOMOTIVE

S-PBGA-B416

Not Qualified

125 °C

-40 °C

260

416

PLASTIC/EPOXY

HBGA

BGA416,26X26,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

2.55 mm

27 mm

NXP SEMICONDUCTORS

unknown

8542.31.00.01

Check for Price

Not Recommended

80 MHz

2097152

65536

20 MHz

220

YES

1.5 V

MICROCONTROLLER

CMOS

IT ALSO REQUIRES 3.3V SUPPLY

YES

FLASH

1.65 V

1.35 V

AUTOMOTIVE

S-PBGA-B416

Not Qualified

125 °C

-40 °C

260

416

PLASTIC/EPOXY

HBGA

BGA416,26X26,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

2.55 mm

27 mm

NXP SEMICONDUCTORS

unknown

8542.31.00.01

$36.7538

Yes

Obsolete

150 MHz

2097152

65536

40 MHz

127

YES

1.5 V

MICROCONTROLLER

CMOS

YES

FLASH

1.58 V

1.42 V

AUTOMOTIVE

S-PBGA-B416

125 °C

-40 °C

260

416

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

BALL

1 mm

BOTTOM

2.5 mm

27 mm

INFINEON TECHNOLOGIES AG

compliant

8542.31.00.01

GREEN, PLASTIC, BGA-416

3A991.A.2

Infineon

Check for Price

Not Recommended

112 MHz

2097152

65536

20 MHz

220

YES

1.5 V

MICROCONTROLLER

CMOS

IT ALSO REQUIRES 3.3V SUPPLY

YES

FLASH

600 mA

1.65 V

1.35 V

AUTOMOTIVE

S-PBGA-B416

Not Qualified

125 °C

-40 °C

245

416

PLASTIC/EPOXY

HBGA

BGA416,26X26,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Lead (Sn/Pb)

BALL

1 mm

BOTTOM

2.55 mm

27 mm

NXP SEMICONDUCTORS

unknown

8542.31.00.01

Check for Price

Yes

Transferred

112 MHz

2097152

65536

20 MHz

YES

1.5 V

MICROCONTROLLER

CMOS

IT ALSO REQUIRES 3.3V SUPPLY

YES

FLASH

1.65 V

1.35 V

AUTOMOTIVE

S-PBGA-B416

Not Qualified

125 °C

-40 °C

416

PLASTIC/EPOXY

HBGA

BGA416,26X26,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

BALL

1 mm

BOTTOM

2.55 mm

27 mm

FREESCALE SEMICONDUCTOR INC

compliant

8542.31.00.01

27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, TEPBGA-416

BGA

416

1 2 3 4 Next

Compare

935309596557

NXP Semiconductors

Check for Price

Not Recommended

132 MHz

2097152

65536

20 MHz

220

YES

1.5 V

MICROCONTROLLER

CMOS

IT ALSO REQUIRES 3.3V SUPPLY

YES

FLASH

600 mA

1.65 V

1.35 V

AUTOMOTIVE

S-PBGA-B416

Not Qualified

125 °C

-40 °C

245

416

PLASTIC/EPOXY

HBGA

BGA416,26X26,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Lead/Silver (Sn/Pb/Ag)

BALL

1 mm

BOTTOM

2.55 mm

27 mm

NXP SEMICONDUCTORS

unknown

8542.31.00.01

MPC5554AZP132R2

NXP Semiconductors

Check for Price

Not Recommended

132 MHz

2097152

65536

20 MHz

YES

1.5 V

MICROCONTROLLER

CMOS

IT ALSO REQUIRES 3.3V SUPPLY

YES

FLASH

1.65 V

1.35 V

MILITARY

S-PBGA-B416

Not Qualified

125 °C

-55 °C

416

PLASTIC/EPOXY

HBGA

BGA416,26X26,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

TIN LEAD SILVER

BALL

1 mm

BOTTOM

2.55 mm

27 mm

NXP SEMICONDUCTORS

unknown

8542.31.00.01

27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, TEBGA-416

3A001.A.2.C

SPC5554MVR132

Freescale Semiconductor

Check for Price

Yes

Transferred

132 MHz

2097152

65536

20 MHz

256

YES

1.5 V

MICROCONTROLLER

CMOS

ALSO OPERATES AT 3.3 V

YES

FLASH

875 mA

1.65 V

1.35 V

AUTOMOTIVE

S-PBGA-B416

Not Qualified

125 °C

-40 °C

260

AEC-Q100

416

PLASTIC/EPOXY

HBGA

BGA416,26X26,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

2.55 mm

27 mm

FREESCALE SEMICONDUCTOR INC

compliant

27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, MS-034AAL-1, TEPBGA-416

NXP

MPC5554AZP132

Freescale Semiconductor

Check for Price

Transferred

132 MHz

2097152

65536

20 MHz

YES

1.5 V

MICROCONTROLLER

CMOS

IT ALSO REQUIRES 3.3V SUPPLY

YES

FLASH

600 mA

1.65 V

1.35 V

MILITARY

S-PBGA-B416

Not Qualified

125 °C

-55 °C

245

416

PLASTIC/EPOXY

HBGA

BGA416,26X26,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

TIN LEAD SILVER

BALL

1 mm

BOTTOM

2.55 mm

27 mm

FREESCALE SEMICONDUCTOR INC

not_compliant

8542.31.00.01

27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, TEBGA-416

3A991.A.2

NXP

BGA

416

MPC5554MZP112

NXP Semiconductors

$58.2867

Not Recommended

112 MHz

2097152

65536

20 MHz

220

YES

1.5 V

MICROCONTROLLER

CMOS

IT ALSO REQUIRES 3.3V SUPPLY

YES

FLASH

600 mA

1.65 V

1.35 V

AUTOMOTIVE

S-PBGA-B416

Not Qualified

125 °C

-40 °C

245

416

PLASTIC/EPOXY

HBGA

BGA416,26X26,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Lead (Sn/Pb)

BALL

1 mm

BOTTOM

2.55 mm

27 mm

NXP SEMICONDUCTORS

unknown

8542.31.00.01

TEPBGA-416

3A991.A.2

NXP

935322743557

NXP Semiconductors

Check for Price

Not Recommended

132 MHz

2097152

65536

20 MHz

220

YES

1.5 V

MICROCONTROLLER

CMOS

IT ALSO REQUIRES 3.3V SUPPLY

YES

FLASH

600 mA

1.65 V

1.35 V

AUTOMOTIVE

S-PBGA-B416

Not Qualified

125 °C

-40 °C

260

416

PLASTIC/EPOXY

HBGA

BGA416,26X26,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

2.55 mm

27 mm

NXP SEMICONDUCTORS

unknown

8542.31.00.01

935319212557

NXP Semiconductors

Check for Price

Not Recommended

80 MHz

2097152

65536

20 MHz

220

YES

1.5 V

MICROCONTROLLER

CMOS

IT ALSO REQUIRES 3.3V SUPPLY

YES

FLASH

1.65 V

1.35 V

AUTOMOTIVE

S-PBGA-B416

Not Qualified

125 °C

-40 °C

260

416

PLASTIC/EPOXY

HBGA

BGA416,26X26,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

2.55 mm

27 mm

NXP SEMICONDUCTORS

unknown

8542.31.00.01

TC1796256F150EBEKXUMA2

Infineon Technologies AG

$36.7538

Yes

Obsolete

150 MHz

2097152

65536

40 MHz

127

YES

1.5 V

MICROCONTROLLER

CMOS

YES

FLASH

1.58 V

1.42 V

AUTOMOTIVE

S-PBGA-B416

125 °C

-40 °C

260

416

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

BALL

1 mm

BOTTOM

2.5 mm

27 mm

INFINEON TECHNOLOGIES AG

compliant

8542.31.00.01

GREEN, PLASTIC, BGA-416

3A991.A.2

Infineon

935309507557

NXP Semiconductors

Check for Price

Not Recommended

112 MHz

2097152

65536

20 MHz

220

YES

1.5 V

MICROCONTROLLER

CMOS

IT ALSO REQUIRES 3.3V SUPPLY

YES

FLASH

600 mA

1.65 V

1.35 V

AUTOMOTIVE

S-PBGA-B416

Not Qualified

125 °C

-40 °C

245

416

PLASTIC/EPOXY

HBGA

BGA416,26X26,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Lead (Sn/Pb)

BALL

1 mm

BOTTOM

2.55 mm

27 mm

NXP SEMICONDUCTORS

unknown

8542.31.00.01

MPC5554MVR112

Freescale Semiconductor

Check for Price

Yes

Transferred

112 MHz

2097152

65536

20 MHz

YES

1.5 V

MICROCONTROLLER

CMOS

IT ALSO REQUIRES 3.3V SUPPLY

YES

FLASH

1.65 V

1.35 V

AUTOMOTIVE

S-PBGA-B416

Not Qualified

125 °C

-40 °C

416

PLASTIC/EPOXY

HBGA

BGA416,26X26,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

BALL

1 mm

BOTTOM

2.55 mm

27 mm

FREESCALE SEMICONDUCTOR INC

compliant

8542.31.00.01

27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, TEPBGA-416

BGA

416

1 2 3 4 Next