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Package Code: HBGA uPs/uCs/Peripheral ICs Type: MICROCONTROLLER Sorted By: Number of Serial I/Os
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935309596557
 NXP Semiconductors 		Check for Price Not Recommended 32 132 MHz 2097152 65536 32 24 20 MHz 220 YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 600 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e0 3 125 °C -40 °C 245 30 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Lead/Silver (Sn/Pb/Ag) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS unknown 8542.31.00.01
935309958557
 NXP Semiconductors 		Check for Price Active 32 144 MHz 3145728 131072 E200 32 24 20 MHz 256 YES 1.5 V MICROCONTROLLER CMOS NO YES YES YES FLASH 820 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e4 3 125 °C -40 °C 260 AEC-Q100 40 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Nickel/Gold (Ni/Au) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS unknown 8542.31.00.01 HBGA,
MPC5554MVR80R2
 Freescale Semiconductor 		Check for Price Yes Transferred 32 80 MHz 2097152 65536 32 24 20 MHz YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e1 3 125 °C -40 °C 260 40 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG TIN SILVER COPPER BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm FREESCALE SEMICONDUCTOR INC unknown 8542.31.00.01 HBGA, BGA416,26X26,40 BGA 416 3A991
935317056518
 NXP Semiconductors 		Check for Price Obsolete 32 112 MHz 32 24 20 MHz 256 YES 1.5 V MICROCONTROLLER YES YES YES 1.65 V 1.35 V 416 HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 1 mm BOTTOM 27 mm 27 mm NXP SEMICONDUCTORS unknown 8542.31.00.01 HBGA,
MPC5554MVR132
 NXP Semiconductors 		$70.5387 Yes Not Recommended 32 132 MHz 2097152 65536 32 24 20 MHz 220 YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 600 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e1 3 125 °C -40 °C 260 40 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS compliant 8542.31.00.01 TEPBGA-416 3A991.A.2 NXP
MPC5554AVR132
 Freescale Semiconductor 		Check for Price Yes Transferred 32 132 MHz 2097152 65536 32 24 20 MHz YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 1.65 V 1.35 V MILITARY S-PBGA-B416 Not Qualified 125 °C -55 °C 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm FREESCALE SEMICONDUCTOR INC compliant 8542.31.00.01 HBGA, BGA416,26X26,40 BGA 416 3A001.A.2.C
SPC5554MVR132
 Freescale Semiconductor 		Check for Price Yes Yes Transferred 32 132 MHz 2097152 65536 32 24 20 MHz 256 YES 1.5 V MICROCONTROLLER CMOS ALSO OPERATES AT 3.3 V NO YES YES 8 YES FLASH 875 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e1 3 125 °C -40 °C 260 AEC-Q100 40 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm FREESCALE SEMICONDUCTOR INC compliant 27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, MS-034AAL-1, TEPBGA-416 NXP
MPC5554AZP132
 Freescale Semiconductor 		Check for Price No No Transferred 32 132 MHz 2097152 65536 32 24 20 MHz YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 600 mA 1.65 V 1.35 V MILITARY S-PBGA-B416 Not Qualified e0 3 125 °C -55 °C 245 30 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG TIN LEAD SILVER BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm FREESCALE SEMICONDUCTOR INC not_compliant 8542.31.00.01 27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, TEBGA-416 BGA 416 3A991.A.2 NXP
MPC5554MZP112
 NXP Semiconductors 		$58.2867 No Not Recommended 32 112 MHz 2097152 65536 32 24 20 MHz 220 YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 600 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e0 3 125 °C -40 °C 245 30 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS unknown 8542.31.00.01 TEPBGA-416 3A991.A.2 NXP
MPC5554AZP132
 NXP Semiconductors 		$306.4720 No Not Recommended 32 132 MHz 2097152 65536 32 24 20 MHz 220 YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 600 mA 1.65 V 1.35 V MILITARY S-PBGA-B416 Not Qualified e0 3 125 °C -55 °C 245 30 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS unknown 8542.31.00.01 TEPBGA-416 3A991.A.2 NXP
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