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TC1796256F150EBEKXUMA2
Infineon Technologies AG
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$36.7538 | Yes | Obsolete | 32 | 150 MHz | 2097152 | 65536 | 32 | 24 | 40 MHz | 127 | YES | 1.5 V | MICROCONTROLLER | CMOS | NO | YES | YES | 8 | NO | FLASH | 1.58 V | 1.42 V | AUTOMOTIVE | S-PBGA-B416 | 3 | 125 °C | -40 °C | 260 | 30 | 416 | PLASTIC/EPOXY | HBGA | SQUARE | GRID ARRAY, HEAT SINK/SLUG | BALL | 1 mm | BOTTOM | 2.5 mm | 27 mm | 27 mm | INFINEON TECHNOLOGIES AG | GREEN, PLASTIC, BGA-416 | compliant | 3A991.A.2 | 8542.31.00.01 | Infineon | ||||||||
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TC1796256F150EBDKXUMA1
Infineon Technologies AG
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Check for Price | Obsolete | 32 | 150 MHz | 32 | 24 | 25 MHz | 127 | YES | 1.5 V | MICROCONTROLLER | CMOS | NO | YES | YES | NO | FLASH | 1.58 V | 1.42 V | AUTOMOTIVE | S-PBGA-B416 | 125 °C | -40 °C | 416 | PLASTIC/EPOXY | HBGA | SQUARE | GRID ARRAY, HEAT SINK/SLUG | BALL | 1 mm | BOTTOM | 2.5 mm | 27 mm | 27 mm | INFINEON TECHNOLOGIES AG | HBGA, | unknown | 8542.31.00.01 | |||||||||||||||||
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TC1796256F150EBEKDUMA2
Infineon Technologies AG
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$37.6308 | No | Obsolete | 32 | 150 MHz | 2097152 | 65536 | 32 | 24 | 40 MHz | 127 | YES | 1.5 V | MICROCONTROLLER | CMOS | NO | YES | YES | 8 | NO | FLASH | 1.58 V | 1.42 V | AUTOMOTIVE | S-PBGA-B416 | e1 | 3 | 125 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 416 | PLASTIC/EPOXY | HBGA | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 2.5 mm | 27 mm | 27 mm | INFINEON TECHNOLOGIES AG | HBGA, | unknown | 3A991.A.2 | 8542.31.00.01 | Infineon | ||||||
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935309596557
NXP Semiconductors
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Check for Price | Not Recommended | 32 | 132 MHz | 2097152 | 65536 | 32 | 24 | 20 MHz | 220 | YES | 1.5 V | MICROCONTROLLER | CMOS | IT ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 600 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | e0 | 3 | 125 °C | -40 °C | 245 | 30 | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Tin/Lead/Silver (Sn/Pb/Ag) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | unknown | 8542.31.00.01 | ||||||
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MPC5554MZP112
NXP Semiconductors
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$58.2867 | No | Not Recommended | 32 | 112 MHz | 2097152 | 65536 | 32 | 24 | 20 MHz | 220 | YES | 1.5 V | MICROCONTROLLER | CMOS | IT ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 600 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | e0 | 3 | 125 °C | -40 °C | 245 | 30 | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | TEPBGA-416 | unknown | 3A991.A.2 | 8542.31.00.01 | NXP | ||
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935322743557
NXP Semiconductors
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Check for Price | Not Recommended | 32 | 132 MHz | 2097152 | 65536 | 32 | 24 | 20 MHz | 220 | YES | 1.5 V | MICROCONTROLLER | CMOS | IT ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 600 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | e1 | 3 | 125 °C | -40 °C | 260 | 40 | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | unknown | 8542.31.00.01 | ||||||
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935319212557
NXP Semiconductors
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Check for Price | Not Recommended | 32 | 80 MHz | 2097152 | 65536 | 32 | 24 | 20 MHz | 220 | YES | 1.5 V | MICROCONTROLLER | CMOS | IT ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | e1 | 3 | 125 °C | -40 °C | 260 | 40 | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | unknown | 8542.31.00.01 | |||||||
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935309507557
NXP Semiconductors
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Check for Price | Not Recommended | 32 | 112 MHz | 2097152 | 65536 | 32 | 24 | 20 MHz | 220 | YES | 1.5 V | MICROCONTROLLER | CMOS | IT ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 600 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | e0 | 3 | 125 °C | -40 °C | 245 | 30 | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | unknown | 8542.31.00.01 | ||||||
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935322744557
NXP Semiconductors
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Check for Price | Not Recommended | 32 | 80 MHz | 2097152 | 65536 | 32 | 24 | 20 MHz | 220 | YES | 1.5 V | MICROCONTROLLER | CMOS | IT ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 600 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | e0 | 3 | 125 °C | -40 °C | 245 | 30 | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | unknown | 8542.31.00.01 | ||||||
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MPC5554AVR132
NXP Semiconductors
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Check for Price | Yes | Active | 32 | 132 MHz | 2097152 | 65536 | 32 | 24 | 20 MHz | 220 | YES | 1.5 V | MICROCONTROLLER | CMOS | IT ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 1.65 V | 1.35 V | MILITARY | S-PBGA-B416 | Not Qualified | 125 °C | -55 °C | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | TEPBGA-416 | compliant | 3A001.A.2.C | 8542.31.00.01 |