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Package Code: HBGA uPs/uCs/Peripheral ICs Type: MICROCONTROLLER Sorted By: Has ADC
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PPC5125YVN400
 NXP Semiconductors 		Check for Price Yes Obsolete 32 400 MHz 35 MHz YES 1.4 V MICROCONTROLLER CMOS NO YES NO NO FLASH 1.47 V 1.33 V AUTOMOTIVE S-PBGA-B324 125 °C -40 °C NOT SPECIFIED NOT SPECIFIED 324 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 1 mm BOTTOM 2.55 mm 23 mm 23 mm NXP SEMICONDUCTORS HBGA, compliant 3A991.A.2 8542.31.00.01
PPC5125YVN400R
 NXP Semiconductors 		Check for Price Yes Obsolete 32 400 MHz 35 MHz YES 1.4 V MICROCONTROLLER CMOS NO YES NO NO FLASH 1.47 V 1.33 V AUTOMOTIVE S-PBGA-B324 125 °C -40 °C NOT SPECIFIED NOT SPECIFIED 324 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 1 mm BOTTOM 2.55 mm 23 mm 23 mm NXP SEMICONDUCTORS HBGA, compliant 3A991.A.2 8542.31.00.01
935309596557
 NXP Semiconductors 		Check for Price Not Recommended 32 132 MHz 2097152 65536 32 24 20 MHz 220 YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 600 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e0 3 125 °C -40 °C 245 30 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Lead/Silver (Sn/Pb/Ag) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS unknown 8542.31.00.01
MPC5566MZP112R
 NXP Semiconductors 		Check for Price No Active 32 112 MHz 3145728 131072 32 24 20 MHz 256 YES 1.5 V MICROCONTROLLER CMOS ADC 40-CH IS AVAILABLE NO YES YES 8 YES FLASH 820 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified 125 °C -40 °C 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS TEBGA-416 unknown 8542.31.00.01
935309958557
 NXP Semiconductors 		Check for Price Active 32 144 MHz 3145728 131072 E200 32 24 20 MHz 256 YES 1.5 V MICROCONTROLLER CMOS NO YES YES YES FLASH 820 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e4 3 125 °C -40 °C 260 AEC-Q100 40 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Nickel/Gold (Ni/Au) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS HBGA, unknown 8542.31.00.01
935317056518
 NXP Semiconductors 		Check for Price Obsolete 32 112 MHz 32 24 20 MHz 256 YES 1.5 V MICROCONTROLLER YES YES YES 1.65 V 1.35 V 416 HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 1 mm BOTTOM 27 mm 27 mm NXP SEMICONDUCTORS HBGA, unknown 8542.31.00.01
MPC5554AZP132R2
 NXP Semiconductors 		Check for Price No Not Recommended 32 132 MHz 2097152 65536 32 24 20 MHz YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 1.65 V 1.35 V MILITARY S-PBGA-B416 Not Qualified e0 3 125 °C -55 °C 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG TIN LEAD SILVER BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS 27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, TEBGA-416 unknown 3A001.A.2.C 8542.31.00.01
SPC5554MVR132
 Freescale Semiconductor 		Check for Price Yes Yes Transferred 32 132 MHz 2097152 65536 32 24 20 MHz 256 YES 1.5 V MICROCONTROLLER CMOS ALSO OPERATES AT 3.3 V NO YES YES 8 YES FLASH 875 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e1 3 125 °C -40 °C 260 AEC-Q100 40 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm FREESCALE SEMICONDUCTOR INC 27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, MS-034AAL-1, TEPBGA-416 compliant NXP
MPC5554AZP132
 Freescale Semiconductor 		Check for Price No No Transferred 32 132 MHz 2097152 65536 32 24 20 MHz YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 600 mA 1.65 V 1.35 V MILITARY S-PBGA-B416 Not Qualified e0 3 125 °C -55 °C 245 30 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG TIN LEAD SILVER BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm FREESCALE SEMICONDUCTOR INC 27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, TEBGA-416 not_compliant 3A991.A.2 8542.31.00.01 NXP BGA 416
MPC5554MZP112
 NXP Semiconductors 		$58.2867 No Not Recommended 32 112 MHz 2097152 65536 32 24 20 MHz 220 YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 600 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e0 3 125 °C -40 °C 245 30 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS TEPBGA-416 unknown 3A991.A.2 8542.31.00.01 NXP
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