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MPC5554MVR80R2
Freescale Semiconductor
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Check for Price | Yes | Transferred | 32 | 80 MHz | 2097152 | 65536 | 32 | 24 | 20 MHz | YES | 1.5 V | MICROCONTROLLER | CMOS | IT ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | e1 | 3 | 125 °C | -40 °C | 260 | 40 | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | FREESCALE SEMICONDUCTOR INC | BGA | HBGA, BGA416,26X26,40 | 416 | unknown | 3A991 | 8542.31.00.01 | |||||||
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MPC5566MZP112R
NXP Semiconductors
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Check for Price | No | Active | 32 | 112 MHz | 3145728 | 131072 | 32 | 24 | 20 MHz | 256 | YES | 1.5 V | MICROCONTROLLER | CMOS | ADC 40-CH IS AVAILABLE | NO | YES | YES | 8 | YES | FLASH | 820 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | 125 °C | -40 °C | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | TEBGA-416 | unknown | 8542.31.00.01 | |||||||||||||
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MPC5554MVR132
NXP Semiconductors
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$70.5387 | Yes | Not Recommended | 32 | 132 MHz | 2097152 | 65536 | 32 | 24 | 20 MHz | 220 | YES | 1.5 V | MICROCONTROLLER | CMOS | IT ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 600 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | e1 | 3 | 125 °C | -40 °C | 260 | 40 | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | TEPBGA-416 | compliant | 3A991.A.2 | 8542.31.00.01 | NXP | ||||||
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MPC5554AVR132
Freescale Semiconductor
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Check for Price | Yes | Transferred | 32 | 132 MHz | 2097152 | 65536 | 32 | 24 | 20 MHz | YES | 1.5 V | MICROCONTROLLER | CMOS | IT ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 1.65 V | 1.35 V | MILITARY | S-PBGA-B416 | Not Qualified | 125 °C | -55 °C | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | FREESCALE SEMICONDUCTOR INC | BGA | HBGA, BGA416,26X26,40 | 416 | compliant | 3A001.A.2.C | 8542.31.00.01 | ||||||||||||
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MPC5554AZP132R2
NXP Semiconductors
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Check for Price | No | Not Recommended | 32 | 132 MHz | 2097152 | 65536 | 32 | 24 | 20 MHz | YES | 1.5 V | MICROCONTROLLER | CMOS | IT ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 1.65 V | 1.35 V | MILITARY | S-PBGA-B416 | Not Qualified | e0 | 3 | 125 °C | -55 °C | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | TIN LEAD SILVER | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | 27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, TEBGA-416 | unknown | 3A001.A.2.C | 8542.31.00.01 | |||||||||||
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MPC5554AZP132
NXP Semiconductors
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$306.4720 | No | Not Recommended | 32 | 132 MHz | 2097152 | 65536 | 32 | 24 | 20 MHz | 220 | YES | 1.5 V | MICROCONTROLLER | CMOS | IT ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 600 mA | 1.65 V | 1.35 V | MILITARY | S-PBGA-B416 | Not Qualified | e0 | 3 | 125 °C | -55 °C | 245 | 30 | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | TEPBGA-416 | unknown | 3A991.A.2 | 8542.31.00.01 | NXP | ||||||
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MPC5554MZP112
NXP Semiconductors
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$58.2867 | No | Not Recommended | 32 | 112 MHz | 2097152 | 65536 | 32 | 24 | 20 MHz | 220 | YES | 1.5 V | MICROCONTROLLER | CMOS | IT ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 600 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | e0 | 3 | 125 °C | -40 °C | 245 | 30 | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | TEPBGA-416 | unknown | 3A991.A.2 | 8542.31.00.01 | NXP | ||||||
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MPC5554AZP132
Freescale Semiconductor
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Check for Price | No | No | Transferred | 32 | 132 MHz | 2097152 | 65536 | 32 | 24 | 20 MHz | YES | 1.5 V | MICROCONTROLLER | CMOS | IT ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 600 mA | 1.65 V | 1.35 V | MILITARY | S-PBGA-B416 | Not Qualified | e0 | 3 | 125 °C | -55 °C | 245 | 30 | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | TIN LEAD SILVER | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | FREESCALE SEMICONDUCTOR INC | BGA | 27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, TEBGA-416 | 416 | not_compliant | 3A991.A.2 | 8542.31.00.01 | NXP | ||||
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SPC5554MVR132
Freescale Semiconductor
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Check for Price | Yes | Yes | Transferred | 32 | 132 MHz | 2097152 | 65536 | 32 | 24 | 20 MHz | 256 | YES | 1.5 V | MICROCONTROLLER | CMOS | ALSO OPERATES AT 3.3 V | NO | YES | YES | 8 | YES | FLASH | 875 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | e1 | 3 | 125 °C | -40 °C | 260 | AEC-Q100 | 40 | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | FREESCALE SEMICONDUCTOR INC | 27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, MS-034AAL-1, TEPBGA-416 | compliant | NXP | ||||||
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MPC5566MVR80R
NXP Semiconductors
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Check for Price | Yes | Active | 32 | 80 MHz | 3145728 | 131072 | 32 | 24 | 20 MHz | 256 | YES | 1.5 V | MICROCONTROLLER | CMOS | ADC 40-CH IS AVAILABLE | NO | YES | YES | 8 | YES | FLASH | 820 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | 125 °C | -40 °C | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | TEBGA-416 | compliant | 8542.31.00.01 |