Parametric results for: Microcontroller under Microcontrollers

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Package Code: HBGA uPs/uCs/Peripheral ICs Type: MICROCONTROLLER Sorted By: Risk Rank
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MPC5554MZP132
NXP Semiconductors
$42.2773 No Not Recommended 32 132 MHz 2097152 65536 32 24 20 MHz 220 YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 600 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e0 3 125 °C -40 °C 245 30 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Lead/Silver (Sn/Pb/Ag) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS TEPBGA-416 not_compliant 3A991.A.2 8542.31.00.01 NXP
SPC5566MZP144
NXP Semiconductors
$77.6718 No Active 32 144 MHz 3145728 131072 E200 32 24 20 MHz 256 YES 1.5 V MICROCONTROLLER CMOS NO YES YES 8 YES FLASH 820 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e4 3 125 °C -40 °C 260 AEC-Q100 40 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Nickel/Gold (Ni/Au) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS 27 X 27 MM, 2.55 HEIGHT, 1 MM PITCH, HAL... more not_compliant 3A991.A.2 8542.31.00.01
MPC5554AZP132
NXP Semiconductors
$180.1939 No Not Recommended 32 132 MHz 2097152 65536 32 24 20 MHz 220 YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 600 mA 1.65 V 1.35 V MILITARY S-PBGA-B416 Not Qualified e0 3 125 °C -55 °C 245 30 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS TEPBGA-416 unknown 3A991.A.2 8542.31.00.01 NXP
MPC5554MZP80
NXP Semiconductors
$57.2454 No Not Recommended 32 80 MHz 2097152 65536 32 24 20 MHz 220 YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 600 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e0 3 125 °C -40 °C 245 30 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS TEPBGA-416 unknown 3A991.A.2 8542.31.00.01 NXP
SPC5554MVR132
NXP Semiconductors
$60.2630 Yes Not Recommended 32 132 MHz 2097152 65536 32 24 20 MHz 256 YES 1.5 V MICROCONTROLLER CMOS ALSO OPERATES AT 3.3 V NO YES YES 8 YES FLASH 875 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e1 3 125 °C -40 °C 260 AEC-Q100 40 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS 27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, MS-034AAL-1, TEPBGA-416 compliant 3A991.A.2 8542.31.00.01 NXP
TC1796256F150EBEKXUMA2
Infineon Technologies AG
$36.7538 Yes Obsolete 32 150 MHz 2097152 65536 32 24 40 MHz 127 YES 1.5 V MICROCONTROLLER CMOS NO YES YES 8 NO FLASH 1.58 V 1.42 V AUTOMOTIVE S-PBGA-B416 3 125 °C -40 °C 260 30 416 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 1 mm BOTTOM 2.5 mm 27 mm 27 mm INFINEON TECHNOLOGIES AG GREEN, PLASTIC, BGA-416 compliant 3A991.A.2 8542.31.00.01 Infineon
TC1796256F150EBEKDUMA2
Infineon Technologies AG
$37.6308 No Obsolete 32 150 MHz 2097152 65536 32 24 40 MHz 127 YES 1.5 V MICROCONTROLLER CMOS NO YES YES 8 NO FLASH 1.58 V 1.42 V AUTOMOTIVE S-PBGA-B416 e1 3 125 °C -40 °C NOT SPECIFIED NOT SPECIFIED 416 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 2.5 mm 27 mm 27 mm INFINEON TECHNOLOGIES AG HBGA, unknown 3A991.A.2 8542.31.00.01 Infineon
MPC5554MVR132
NXP Semiconductors
$70.5387 Yes Not Recommended 32 132 MHz 2097152 65536 32 24 20 MHz 220 YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 600 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e1 3 125 °C -40 °C 260 40 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS TEPBGA-416 compliant 3A991.A.2 8542.31.00.01 NXP
MPC5554MZP112
NXP Semiconductors
$58.2867 No Not Recommended 32 112 MHz 2097152 65536 32 24 20 MHz 220 YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 600 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e0 3 125 °C -40 °C 245 30 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS TEPBGA-416 unknown 3A991.A.2 8542.31.00.01 NXP