Findchips: Parametric Search Results for Microcontroller


Select Parts		Part Number

		MPC5554MVR132 Freescale Semiconductor
		MPC5554MVR132R2 Freescale Semiconductor
		SPC5554MVR132 Freescale Semiconductor

				Most Relevant										Technical													Compliance			Operating Conditions						Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	ROM (words)	RAM (bytes)	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Number of I/O Lines	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Additional Feature	DAC Channels	DMA Channels	Has ADC	On Chip Program ROM Width	PWM Channels	ROM Programmability	Supply Current-Max	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Screening Level	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

Check for Price

Yes

Transferred

132 MHz

2097152

65536

20 MHz

YES

1.5 V

MICROCONTROLLER

CMOS

IT ALSO REQUIRES 3.3V SUPPLY

YES

FLASH

600 mA

1.65 V

1.35 V

AUTOMOTIVE

S-PBGA-B416

Not Qualified

125 °C

-40 °C

260

416

PLASTIC/EPOXY

HBGA

BGA416,26X26,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

2.55 mm

27 mm

FREESCALE SEMICONDUCTOR INC

BGA

27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, TEPBGA-416

416

compliant

3A991.A.2

8542.31.00.01

NXP

Check for Price

Yes

Transferred

132 MHz

2097152

65536

20 MHz

YES

1.5 V

MICROCONTROLLER

CMOS

IT ALSO REQUIRES 3.3V SUPPLY

YES

FLASH

600 mA

1.65 V

1.35 V

AUTOMOTIVE

S-PBGA-B416

Not Qualified

125 °C

-40 °C

260

416

PLASTIC/EPOXY

HBGA

BGA416,26X26,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

TIN SILVER COPPER

BALL

1 mm

BOTTOM

2.55 mm

27 mm

FREESCALE SEMICONDUCTOR INC

BGA

HBGA, BGA416,26X26,40

416

unknown

3A991

8542.31.00.01

Check for Price

Yes

Transferred

132 MHz

2097152

65536

20 MHz

256

YES

1.5 V

MICROCONTROLLER

CMOS

ALSO OPERATES AT 3.3 V

YES

FLASH

875 mA

1.65 V

1.35 V

AUTOMOTIVE

S-PBGA-B416

Not Qualified

125 °C

-40 °C

260

AEC-Q100

416

PLASTIC/EPOXY

HBGA

BGA416,26X26,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

2.55 mm

27 mm

FREESCALE SEMICONDUCTOR INC

27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, MS-034AAL-1, TEPBGA-416

compliant

NXP

Compare

MPC5554MVR132

Freescale Semiconductor

Check for Price

Yes

Transferred

132 MHz

2097152

65536

20 MHz

YES

1.5 V

MICROCONTROLLER

CMOS

IT ALSO REQUIRES 3.3V SUPPLY

YES

FLASH

600 mA

1.65 V

1.35 V

AUTOMOTIVE

S-PBGA-B416

Not Qualified

125 °C

-40 °C

260

416

PLASTIC/EPOXY

HBGA

BGA416,26X26,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

2.55 mm

27 mm

FREESCALE SEMICONDUCTOR INC

BGA

27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, TEPBGA-416

416

compliant

3A991.A.2

8542.31.00.01

NXP

MPC5554MVR132R2

Freescale Semiconductor

Check for Price

Yes

Transferred

132 MHz

2097152

65536

20 MHz

YES

1.5 V

MICROCONTROLLER

CMOS

IT ALSO REQUIRES 3.3V SUPPLY

YES

FLASH

600 mA

1.65 V

1.35 V

AUTOMOTIVE

S-PBGA-B416

Not Qualified

125 °C

-40 °C

260

416

PLASTIC/EPOXY

HBGA

BGA416,26X26,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

TIN SILVER COPPER

BALL

1 mm

BOTTOM

2.55 mm

27 mm

FREESCALE SEMICONDUCTOR INC

BGA

HBGA, BGA416,26X26,40

416

unknown

3A991

8542.31.00.01

SPC5554MVR132

Freescale Semiconductor

Check for Price

Yes

Transferred

132 MHz

2097152

65536

20 MHz

256

YES

1.5 V

MICROCONTROLLER

CMOS

ALSO OPERATES AT 3.3 V

YES

FLASH

875 mA

1.65 V

1.35 V

AUTOMOTIVE

S-PBGA-B416

Not Qualified

125 °C

-40 °C

260

AEC-Q100

416

PLASTIC/EPOXY

HBGA

BGA416,26X26,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

2.55 mm

27 mm

FREESCALE SEMICONDUCTOR INC

27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, MS-034AAL-1, TEPBGA-416

compliant

NXP

Parametric results for: Microcontroller under Microcontrollers