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Package Code: HBGA ROM Programmability: FLASH uPs/uCs/Peripheral ICs Type: MICROCONTROLLER Sorted By: Risk Rank
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MPC5566MVR144
 NXP Semiconductors 		Check for Price Yes Active 32 144 MHz 3145728 131072 32 24 20 MHz 256 YES 1.5 V MICROCONTROLLER CMOS ADC 40-CH IS AVAILABLE NO YES YES 8 YES FLASH 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 125 °C -40 °C 416 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS TEBGA-416 compliant 8542.31.00.01
MPC5554MVR112R2
 NXP Semiconductors 		Check for Price Yes Active 32 112 MHz 2097152 65536 32 24 20 MHz YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified 125 °C -40 °C 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS 27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, TEPBGA-416 compliant 8542.31.00.01
MPC5566MVR80R
 NXP Semiconductors 		Check for Price Yes Active 32 80 MHz 3145728 131072 32 24 20 MHz 256 YES 1.5 V MICROCONTROLLER CMOS ADC 40-CH IS AVAILABLE NO YES YES 8 YES FLASH 820 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified 125 °C -40 °C 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS TEBGA-416 compliant 8542.31.00.01
935309958557
 NXP Semiconductors 		Check for Price Active 32 144 MHz 3145728 131072 E200 32 24 20 MHz 256 YES 1.5 V MICROCONTROLLER CMOS NO YES YES YES FLASH 820 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e4 3 125 °C -40 °C 260 AEC-Q100 40 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Nickel/Gold (Ni/Au) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS HBGA, unknown 8542.31.00.01
MPC5554AVR132
 Freescale Semiconductor 		Check for Price Yes Transferred 32 132 MHz 2097152 65536 32 24 20 MHz YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 1.65 V 1.35 V MILITARY S-PBGA-B416 Not Qualified 125 °C -55 °C 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm FREESCALE SEMICONDUCTOR INC HBGA, BGA416,26X26,40 compliant 8542.31.00.01 BGA 416 3A001.A.2.C
MPC5554MVR132R2
 Freescale Semiconductor 		Check for Price Yes Yes Transferred 32 132 MHz 2097152 65536 32 24 20 MHz YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 600 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e1 3 125 °C -40 °C 260 40 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG TIN SILVER COPPER BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm FREESCALE SEMICONDUCTOR INC HBGA, BGA416,26X26,40 unknown 8542.31.00.01 BGA 416 3A991
MPC5554MZP112
 Freescale Semiconductor 		Check for Price No No Transferred 32 112 MHz 2097152 65536 32 24 20 MHz YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 600 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e0 3 125 °C -40 °C 245 30 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG TIN LEAD SILVER BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm FREESCALE SEMICONDUCTOR INC 27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, TEBGA-416 not_compliant 8542.31.00.01 BGA 416 3A991.A.2 NXP
MPC5554AZP132R2
 Freescale Semiconductor 		Check for Price No No Transferred 32 132 MHz 2097152 65536 32 24 20 MHz YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 1.65 V 1.35 V MILITARY S-PBGA-B416 Not Qualified e0 3 125 °C -55 °C 245 30 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Lead/Silver (Sn/Pb/Ag) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm FREESCALE SEMICONDUCTOR INC 27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, TEBGA-416 not_compliant 8542.31.00.01 BGA 416 3A001.A.2.C
MPC5554MVR80
 Freescale Semiconductor 		Check for Price Yes Yes Transferred 32 80 MHz 2097152 65536 32 24 20 MHz YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e1 3 125 °C -40 °C 260 40 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG TIN SILVER COPPER BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm FREESCALE SEMICONDUCTOR INC 27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, TEPBGA-416 compliant 8542.31.00.01 BGA 416 3A991.A.2
MPC5554MVR80R2
 Freescale Semiconductor 		Check for Price Yes Transferred 32 80 MHz 2097152 65536 32 24 20 MHz YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e1 3 125 °C -40 °C 260 40 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG TIN SILVER COPPER BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm FREESCALE SEMICONDUCTOR INC HBGA, BGA416,26X26,40 unknown 8542.31.00.01 BGA 416 3A991
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