Parametric results for: Microcontroller under Microcontrollers

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Package Code: HBGA Part Life Cycle Code: Obsolete uPs/uCs/Peripheral ICs Type: MICROCONTROLLER Sorted By: Risk Rank
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935317056518
NXP Semiconductors
Check for Price Obsolete 32 112 MHz 32 24 20 MHz 256 YES 1.5 V MICROCONTROLLER YES YES YES 1.65 V 1.35 V 416 HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 1 mm BOTTOM 27 mm 27 mm NXP SEMICONDUCTORS HBGA, unknown 8542.31.00.01
TC1796256F150EBDKXUMA1
Infineon Technologies AG
Check for Price Obsolete 32 150 MHz 32 24 25 MHz 127 YES 1.5 V MICROCONTROLLER CMOS NO YES YES NO FLASH 1.58 V 1.42 V AUTOMOTIVE S-PBGA-B416 125 °C -40 °C 416 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 1 mm BOTTOM 2.5 mm 27 mm 27 mm INFINEON TECHNOLOGIES AG HBGA, unknown 8542.31.00.01
TC1796256F150EBEKXUMA2
Infineon Technologies AG
$36.7538 Yes Obsolete 32 150 MHz 2097152 65536 32 24 40 MHz 127 YES 1.5 V MICROCONTROLLER CMOS NO YES YES 8 NO FLASH 1.58 V 1.42 V AUTOMOTIVE S-PBGA-B416 3 125 °C -40 °C 260 30 416 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 1 mm BOTTOM 2.5 mm 27 mm 27 mm INFINEON TECHNOLOGIES AG GREEN, PLASTIC, BGA-416 compliant 8542.31.00.01 3A991.A.2 Infineon
PPC5125YVN400
NXP Semiconductors
Check for Price Yes Obsolete 32 400 MHz 35 MHz YES 1.4 V MICROCONTROLLER CMOS NO YES NO NO FLASH 1.47 V 1.33 V AUTOMOTIVE S-PBGA-B324 125 °C -40 °C NOT SPECIFIED NOT SPECIFIED 324 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 1 mm BOTTOM 2.55 mm 23 mm 23 mm NXP SEMICONDUCTORS HBGA, compliant 8542.31.00.01 3A991.A.2
STLS2F02
STMicroelectronics
Check for Price Yes Obsolete 64 900 MHz 64 15 YES 1.26 V MICROCONTROLLER CMOS YES FLOATING POINT YES YES 4 1.32 V 1.2 V INDUSTRIAL S-PBGA-B452 Not Qualified 85 °C -40 °C 452 PLASTIC/EPOXY HBGA BGA452,26X26,40 SQUARE GRID ARRAY BALL 1 mm BOTTOM 3.15 mm 27 mm 27 mm STMICROELECTRONICS HBGA, BGA452,26X26,40 compliant 8542.31.00.01 BGA 452
PPC5125YVN400R
NXP Semiconductors
Check for Price Yes Obsolete 32 400 MHz 35 MHz YES 1.4 V MICROCONTROLLER CMOS NO YES NO NO FLASH 1.47 V 1.33 V AUTOMOTIVE S-PBGA-B324 125 °C -40 °C NOT SPECIFIED NOT SPECIFIED 324 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 1 mm BOTTOM 2.55 mm 23 mm 23 mm NXP SEMICONDUCTORS HBGA, compliant 8542.31.00.01 3A991.A.2
TC1796256F150EBEKDUMA2
Infineon Technologies AG
$37.6308 No Obsolete 32 150 MHz 2097152 65536 32 24 40 MHz 127 YES 1.5 V MICROCONTROLLER CMOS NO YES YES 8 NO FLASH 1.58 V 1.42 V AUTOMOTIVE S-PBGA-B416 e1 3 125 °C -40 °C NOT SPECIFIED NOT SPECIFIED 416 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 2.5 mm 27 mm 27 mm INFINEON TECHNOLOGIES AG HBGA, unknown 8542.31.00.01 3A991.A.2 Infineon