Parametric results for: Microcontroller under Microcontrollers

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Package Code: BGA Part Life Cycle Code: Not Recommended uPs/uCs/Peripheral ICs Type: MICROCONTROLLER Sorted By: Risk Rank
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SPC5534MVM80R
NXP Semiconductors
$26.7104 Yes Not Recommended 32 80 MHz 1048576 65536 E200 20 MHz YES 1.5 V MICROCONTROLLER CMOS YES YES YES FLASH 250 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B208 Not Qualified e1 3 125 °C -40 °C 260 AEC-Q100 40 208 PLASTIC BGA BGA208,16X16,40 SQUARE GRID ARRAY TIN SILVER COPPER BALL 1 mm BOTTOM 17 mm 17 mm NXP SEMICONDUCTORS compliant 3A991.A.2 8542.31.00.01 NXP
MPC5553MZQ132
NXP Semiconductors
$34.9361 No Not Recommended 32 132 MHz 1572864 65536 32 24 20 MHz YES 1.5 V MICROCONTROLLER CMOS ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 510 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B324 Not Qualified e0 3 125 °C -40 °C 245 30 324 PLASTIC/EPOXY BGA BGA324,22X22,40 SQUARE GRID ARRAY Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 2.55 mm 23 mm 23 mm NXP SEMICONDUCTORS unknown 3A991.A.2 8542.31.00.01 NXP 23 X 23 MM, 1 MM PITCH, PLASTIC, MS-034AAJ-1, BGA-324
ST10F280-Q3TR
STMicroelectronics
$28.0488 Not Recommended 16 40 MHz 80 MHz 143 YES 5 V MICROCONTROLLER CMOS NO NO YES YES FLASH 5.5 V 4.5 V AUTOMOTIVE S-PBGA-B208 Not Qualified e2 3 125 °C -40 °C 260 30 208 PLASTIC/EPOXY BGA SQUARE GRID ARRAY TIN SILVER BALL 1.27 mm BOTTOM 1.96 mm 23 mm 23 mm STMICROELECTRONICS compliant 5A991.B.4.A 8542.31.00.01 ROHS COMPLIANT, 23 X 23 MM, 1.96 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-208 BGA 208
MPC561MVR56
NXP Semiconductors
$59.7913 Yes Not Recommended 32 56 MHz 32768 16 24 25 MHz YES 2.6 V MICROCONTROLLER CMOS YES YES YES 2.7 V 2.5 V AUTOMOTIVE S-PBGA-B388 Not Qualified e1 3 125 °C -40 °C 260 40 388 PLASTIC/EPOXY BGA BGA388,26X26,40 SQUARE GRID ARRAY Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 27 mm 27 mm NXP SEMICONDUCTORS compliant 3A991.A.2 8542.31.00.01
MPC563MVR56
NXP Semiconductors
$98.7773 Yes Not Recommended 32 56 MHz 524288 32768 16 24 25 MHz YES 2.6 V MICROCONTROLLER CMOS YES YES YES FLASH 2.7 V 2.5 V AUTOMOTIVE S-PBGA-B388 Not Qualified e1 3 125 °C -40 °C 260 40 388 PLASTIC/EPOXY BGA BGA388,26X26,40 SQUARE GRID ARRAY Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 27 mm 27 mm NXP SEMICONDUCTORS compliant 3A991.A.2 8542.31.00.01 NXP
MPC563MVR66R
NXP Semiconductors
Check for Price Yes Not Recommended 32 66 MHz 524288 32768 16 24 25 MHz YES 2.6 V MICROCONTROLLER CMOS YES YES YES FLASH 2.7 V 2.5 V AUTOMOTIVE S-PBGA-B388 Not Qualified e1 3 125 °C -40 °C 260 40 388 PLASTIC/EPOXY BGA BGA388,26X26,40 SQUARE GRID ARRAY Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 27 mm 27 mm NXP SEMICONDUCTORS compliant 3A991.A.2 8542.31.00.01 NXP
935313624557
NXP Semiconductors
Check for Price Not Recommended 32 132 MHz 1572864 65536 32 24 20 MHz YES 1.5 V MICROCONTROLLER CMOS ALSO REQUIRES 3.3V SUPPLY NO NO YES YES FLASH 510 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B324 Not Qualified e0 3 125 °C -40 °C 245 30 324 PLASTIC/EPOXY BGA BGA324,22X22,40 SQUARE GRID ARRAY Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 2.55 mm 23 mm 23 mm NXP SEMICONDUCTORS unknown 8542.31.00.01
935322847557
NXP Semiconductors
Check for Price Not Recommended 32 132 MHz 1572864 65536 32 24 20 MHz YES 1.5 V MICROCONTROLLER CMOS ALSO REQUIRES 3.3V SUPPLY NO NO YES YES FLASH 510 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B324 Not Qualified e1 3 125 °C -40 °C 260 40 324 PLASTIC/EPOXY BGA BGA324,22X22,40 SQUARE GRID ARRAY TIN SILVER COPPER BALL 1 mm BOTTOM 2.55 mm 23 mm 23 mm NXP SEMICONDUCTORS unknown 8542.31.00.01
S1C63158B0A010Q
Epson Electronics America Inc
Check for Price Not Recommended 4 4 MHz 4 MHz YES 3 V MICROCONTROLLER CMOS NO NO NO YES FLASH 3.6 V 2.1 V COMMERCIAL R-PBGA-B Not Qualified 70 °C -20 °C PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY BALL BOTTOM SEIKO EPSON CORP unknown 8542.31.00.01 BGA, BGA
S1C63158B0A0199
Seiko Epson Corporation
Check for Price Not Recommended 4 4 MHz 4 MHz YES 3 V MICROCONTROLLER CMOS NO NO NO YES FLASH 3.6 V 2.1 V COMMERCIAL R-PBGA-B Not Qualified 70 °C -20 °C PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY BALL BOTTOM SEIKO EPSON CORP unknown 8542.31.00.01