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Package Code: LFBGA uPs/uCs/Peripheral ICs Type: MICROCONTROLLER Sorted By: Risk Rank
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UPD703100AF1-33-FA3-A
 Renesas Electronics Corporation 		Check for Price Yes Yes Obsolete 32 33 MHz 4096 V850 16 24 33 MHz 123 YES 3.3 V MICROCONTROLLER MOS NO YES YES NO 3.6 V 3 V INDUSTRIAL S-PBGA-B157 Not Qualified e1 4 85 °C -40 °C 260 10 157 PLASTIC/EPOXY LFBGA BGA157,16X16,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 1.58 mm 14 mm 14 mm RENESAS ELECTRONICS CORP LFBGA LFBGA, BGA157,16X16,32 157 PLBG0157GA compliant 3A991.A.2 8542.31.00.01 Renesas Electronics
UPD70F3102AF1-33-FAA-A
 Renesas Electronics Corporation 		Check for Price Yes Yes Obsolete 32 33 MHz 131072 4096 V850 16 24 33 MHz 123 YES 3.3 V MICROCONTROLLER MOS NO YES YES 8 NO FLASH 3.6 V 3 V INDUSTRIAL S-PBGA-B157 Not Qualified e6 4 85 °C -40 °C 260 10 157 PLASTIC/EPOXY LFBGA BGA157,16X16,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH TIN BISMUTH BALL 800 µm BOTTOM 1.46 mm 14 mm 14 mm RENESAS ELECTRONICS CORP LFBGA LFBGA, BGA157,16X16,32 157 PLBG0157GB compliant 3A991.A.2 8542.31.00.01 Renesas Electronics
UPD703100AF1-33-FA1
 Renesas Electronics Corporation 		Check for Price No Obsolete 32 33 MHz 16 24 33 MHz 123 YES 3.3 V MICROCONTROLLER MOS NO YES YES NO 3.6 V 3 V INDUSTRIAL S-PBGA-B157 Not Qualified e0 85 °C -40 °C 157 PLASTIC/EPOXY LFBGA SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH TIN LEAD BALL 800 µm BOTTOM 1.46 mm 14 mm 14 mm RENESAS ELECTRONICS CORP BGA LFBGA, 157 unknown 3A991.A.2 8542.31.00.01 Renesas Electronics