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Part Life Cycle Code: Not Recommended uPs/uCs/Peripheral ICs Type: MICROCONTROLLER Sorted By: Risk Rank
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MPC5554MZP132
 NXP Semiconductors 		$42.2773 No Not Recommended 32 132 MHz 2097152 65536 32 24 20 MHz 220 YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 600 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e0 3 125 °C -40 °C 245 30 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Lead/Silver (Sn/Pb/Ag) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS TEPBGA-416 not_compliant 3A991.A.2 8542.31.00.01 NXP
MPC5554AZP132
 NXP Semiconductors 		$306.4720 No Not Recommended 32 132 MHz 2097152 65536 32 24 20 MHz 220 YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 600 mA 1.65 V 1.35 V MILITARY S-PBGA-B416 Not Qualified e0 3 125 °C -55 °C 245 30 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS TEPBGA-416 unknown 3A991.A.2 8542.31.00.01 NXP
MPC5554MZP132R2
 NXP Semiconductors 		Check for Price No Not Recommended 32 132 MHz 2097152 65536 32 24 20 MHz YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 600 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e0 3 125 °C -40 °C 245 30 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Lead/Silver (Sn/Pb/Ag) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS 27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, TEBGA-416 not_compliant 3A991.A.2 8542.31.00.01 NXP
MPC5554MZP80
 NXP Semiconductors 		$57.2454 No Not Recommended 32 80 MHz 2097152 65536 32 24 20 MHz 220 YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 600 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e0 3 125 °C -40 °C 245 30 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS TEPBGA-416 unknown 3A991.A.2 8542.31.00.01 NXP
935309596557
 NXP Semiconductors 		Check for Price Not Recommended 32 132 MHz 2097152 65536 32 24 20 MHz 220 YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 600 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e0 3 125 °C -40 °C 245 30 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Lead/Silver (Sn/Pb/Ag) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS unknown 8542.31.00.01
935319212557
 NXP Semiconductors 		Check for Price Not Recommended 32 80 MHz 2097152 65536 32 24 20 MHz 220 YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e1 3 125 °C -40 °C 260 40 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS unknown 8542.31.00.01
935322743557
 NXP Semiconductors 		Check for Price Not Recommended 32 132 MHz 2097152 65536 32 24 20 MHz 220 YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 600 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e1 3 125 °C -40 °C 260 40 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS unknown 8542.31.00.01
935309507557
 NXP Semiconductors 		Check for Price Not Recommended 32 112 MHz 2097152 65536 32 24 20 MHz 220 YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 600 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e0 3 125 °C -40 °C 245 30 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS unknown 8542.31.00.01
935322744518
 NXP Semiconductors 		Check for Price Not Recommended 32 80 MHz 2097152 65536 32 24 20 MHz YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 600 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e0 3 125 °C -40 °C 245 30 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS unknown 8542.31.00.01
935313625557
 NXP Semiconductors 		Check for Price Not Recommended 32 132 MHz 2097152 65536 32 24 20 MHz 220 YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 600 mA 1.65 V 1.35 V MILITARY S-PBGA-B416 Not Qualified e0 3 125 °C -55 °C 245 30 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS unknown 3A001.A.2.C 8542.31.00.01
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