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Package Code: HBGA uPs/uCs/Peripheral ICs Type: MICROCONTROLLER Sorted By: Risk Rank
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MPC5554AVR132R2
 NXP Semiconductors 		Check for Price Yes Active 32 132 MHz 2097152 65536 32 24 20 MHz YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 1.65 V 1.35 V MILITARY S-PBGA-B416 Not Qualified 125 °C -55 °C 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS 27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, TEPBGA-416 compliant 3A001.A.2.C 8542.31.00.01
MPC5554MZP132
 NXP Semiconductors 		$51.1999 No Not Recommended 32 132 MHz 2097152 65536 32 24 20 MHz 220 YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 600 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e0 3 125 °C -40 °C 245 30 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Lead/Silver (Sn/Pb/Ag) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS TEPBGA-416 not_compliant 3A991.A.2 8542.31.00.01 NXP
MPC5554MVR112R2
 NXP Semiconductors 		Check for Price Yes Active 32 112 MHz 2097152 65536 32 24 20 MHz YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified 125 °C -40 °C 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS 27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, TEPBGA-416 compliant 8542.31.00.01
MPC5554MVR132
 Freescale Semiconductor 		Check for Price Yes Yes Transferred 32 132 MHz 2097152 65536 32 24 20 MHz YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 600 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e1 3 125 °C -40 °C 260 40 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm FREESCALE SEMICONDUCTOR INC 27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, TEPBGA-416 compliant 3A991.A.2 8542.31.00.01 NXP BGA 416
MPC5554AVR132
 Freescale Semiconductor 		Check for Price Yes Transferred 32 132 MHz 2097152 65536 32 24 20 MHz YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 1.65 V 1.35 V MILITARY S-PBGA-B416 Not Qualified 125 °C -55 °C 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm FREESCALE SEMICONDUCTOR INC HBGA, BGA416,26X26,40 compliant 3A001.A.2.C 8542.31.00.01 BGA 416
MPC5554MVR132R2
 Freescale Semiconductor 		Check for Price Yes Yes Transferred 32 132 MHz 2097152 65536 32 24 20 MHz YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 600 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e1 3 125 °C -40 °C 260 40 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG TIN SILVER COPPER BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm FREESCALE SEMICONDUCTOR INC HBGA, BGA416,26X26,40 unknown 3A991 8542.31.00.01 BGA 416
MPC5554MZP112
 Freescale Semiconductor 		Check for Price No No Transferred 32 112 MHz 2097152 65536 32 24 20 MHz YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 600 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e0 3 125 °C -40 °C 245 30 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG TIN LEAD SILVER BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm FREESCALE SEMICONDUCTOR INC 27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, TEBGA-416 not_compliant 3A991.A.2 8542.31.00.01 NXP BGA 416
MPC5554AZP132R2
 Freescale Semiconductor 		Check for Price No No Transferred 32 132 MHz 2097152 65536 32 24 20 MHz YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 1.65 V 1.35 V MILITARY S-PBGA-B416 Not Qualified e0 3 125 °C -55 °C 245 30 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Lead/Silver (Sn/Pb/Ag) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm FREESCALE SEMICONDUCTOR INC 27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, TEBGA-416 not_compliant 3A001.A.2.C 8542.31.00.01 BGA 416
MPC5554MVR80
 Freescale Semiconductor 		Check for Price Yes Yes Transferred 32 80 MHz 2097152 65536 32 24 20 MHz YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e1 3 125 °C -40 °C 260 40 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG TIN SILVER COPPER BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm FREESCALE SEMICONDUCTOR INC 27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, TEPBGA-416 compliant 3A991.A.2 8542.31.00.01 BGA 416
MPC5554MVR80R2
 Freescale Semiconductor 		Check for Price Yes Transferred 32 80 MHz 2097152 65536 32 24 20 MHz YES 1.5 V MICROCONTROLLER CMOS IT ALSO REQUIRES 3.3V SUPPLY NO NO YES 8 YES FLASH 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified e1 3 125 °C -40 °C 260 40 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG TIN SILVER COPPER BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm FREESCALE SEMICONDUCTOR INC HBGA, BGA416,26X26,40 unknown 3A991 8542.31.00.01 BGA 416
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