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Package Code: LFBGA uPs/uCs/Peripheral ICs Type: MICROCONTROLLER Sorted By: Price
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935322979557
 NXP Semiconductors 		Check for Price Obsolete 32 50.33 MHz 262144 32768 COLDFIRE 16 MHz 72 YES 3 V MICROCONTROLLER CMOS YES NO YES YES FLASH 48 mA 3.6 V 1.8 V INDUSTRIAL S-PBGA-B104 Not Qualified e1 3 105 °C -40 °C 260 40 104 PLASTIC/EPOXY LFBGA BGA104,11X11,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 1.52 mm 10 mm 10 mm NXP SEMICONDUCTORS LFBGA, unknown 8542.31.00.01
MCF51JE256VML
 Freescale Semiconductor 		Check for Price Yes Yes Transferred 32 50.33 MHz 262144 32768 COLDFIRE 16 MHz 72 YES 3 V MICROCONTROLLER CMOS YES NO YES 8 YES FLASH 48 mA 3.6 V 1.8 V INDUSTRIAL S-PBGA-B104 Not Qualified 3 105 °C -40 °C 260 40 104 PLASTIC/EPOXY LFBGA BGA104,11X11,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH TIN SILVER COPPER OVER NICKEL BALL 800 µm BOTTOM 1.52 mm 10 mm 10 mm FREESCALE SEMICONDUCTOR INC 10 X 10 MM, ROHS COMPLIANT, MAPBGA-104 compliant 8542.31.00.01 BGA 104 3A991.A.2 NXP
MCF51JE256VML
 NXP Semiconductors 		Check for Price Yes Obsolete 32 50.33 MHz 262144 32768 COLDFIRE 16 MHz 72 YES 3 V MICROCONTROLLER CMOS YES NO YES 8 YES FLASH 48 mA 3.6 V 1.8 V INDUSTRIAL S-PBGA-B104 Not Qualified e1 3 105 °C -40 °C 260 40 104 PLASTIC/EPOXY LFBGA BGA104,11X11,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.52 mm 10 mm 10 mm NXP SEMICONDUCTORS 10 X 10 MM, ROHS COMPLIANT, MAPBGA-104 compliant 8542.31.00.01 3A991.A.2 NXP