Parametric results for: Microcontroller under Microcontrollers

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DSPIC33FJ128GP802-I/SO
Microchip Technology Inc
$5.2377 Yes Yes Active 16 16384 40 MHz 7 YES 3.3 V DIGITAL SIGNAL PROCESSOR, CONTROLLER CMOS YES YES FLOATING POINT NO MULTIPLE YES 8 3 3 8 FLASH 75 mA 3.6 V 3 V INDUSTRIAL R-PDSO-G28 Not Qualified e3 1 85 °C -40 °C 250 TS 16949 40 28 PLASTIC/EPOXY SOP SOP28,.4 RECTANGULAR SMALL OUTLINE MATTE TIN GULL WING 1.27 mm DUAL 2.65 mm 7.5 mm 17.9 mm MICROCHIP TECHNOLOGY INC SOIC 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28 28 compliant 3A991.A.2 8542.31.00.01 Microchip
DSPIC33FJ128GP802-E/SP
Microchip Technology Inc
$6.7567 Yes Yes Active 16 16384 40 MHz 7 NO 3.3 V DIGITAL SIGNAL PROCESSOR, CONTROLLER CMOS YES YES FLOATING POINT NO MULTIPLE YES 8 3 3 8 FLASH 76 mA 3.6 V 3 V AUTOMOTIVE R-PDIP-T28 Not Qualified e3 125 °C -40 °C TS 16949 28 PLASTIC/EPOXY DIP DIP28,.3 RECTANGULAR IN-LINE MATTE TIN THROUGH-HOLE 2.54 mm DUAL 5.08 mm 7.62 mm 34.671 mm MICROCHIP TECHNOLOGY INC DIP 0.300 INCH, LEAD FREE, PLASTIC, DIP-28 28 compliant 3A991.A.2 8542.31.00.01 Microchip
DSPIC33FJ128GP802-E/MM
Microchip Technology Inc
$5.2465 Yes Yes Active 16 16384 40 MHz 7 YES 3.3 V DIGITAL SIGNAL PROCESSOR, CONTROLLER CMOS YES YES FLOATING POINT NO MULTIPLE YES 8 3 3 8 FLASH 76 mA 3.6 V 3 V AUTOMOTIVE S-PQCC-N28 Not Qualified e3 1 125 °C -40 °C 260 TS 16949 40 28 PLASTIC/EPOXY HVQCCN LCC28,.24SQ,25 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE MATTE TIN NO LEAD 650 µm QUAD 1 mm 6 mm 6 mm MICROCHIP TECHNOLOGY INC QFN 6 X 6 MM, 0.90 MM HEIGHT, PLASTIC, QFN-28 28 compliant 3A991.A.2 8542.31.00.01 Microchip
DSPIC33FJ128GP802-I/MM
Microchip Technology Inc
$5.6071 Yes Yes Active 16 16384 40 MHz 7 YES 3.3 V DIGITAL SIGNAL PROCESSOR, CONTROLLER CMOS YES YES FLOATING POINT NO MULTIPLE YES 8 3 3 8 FLASH 75 mA 3.6 V 3 V INDUSTRIAL S-PQCC-N28 Not Qualified e3 1 85 °C -40 °C 260 TS 16949 28 PLASTIC/EPOXY HVQCCN LCC28,.24SQ,25 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE MATTE TIN NO LEAD 650 µm QUAD 1 mm 6 mm 6 mm MICROCHIP TECHNOLOGY INC QFN 6 X 6 MM, 0.90 MM HEIGHT, PLASTIC, QFN-28 28 compliant 3A991.A.2 8542.31.00.01 Microchip
DSPIC33FJ128GP802-E/SO
Microchip Technology Inc
$6.2505 Yes Yes Active 16 16384 40 MHz 7 YES 3.3 V DIGITAL SIGNAL PROCESSOR, CONTROLLER CMOS YES YES FLOATING POINT NO MULTIPLE YES 8 3 3 8 FLASH 76 mA 3.6 V 3 V AUTOMOTIVE R-PDSO-G28 Not Qualified e3 1 125 °C -40 °C 260 TS 16949 28 PLASTIC/EPOXY SOP SOP28,.4 RECTANGULAR SMALL OUTLINE MATTE TIN GULL WING 1.27 mm DUAL 2.65 mm 7.5 mm 17.9 mm MICROCHIP TECHNOLOGY INC SOIC 7.50 MM, LEAD FREE, PLASTIC, SOIC-28 28 compliant 3A991.A.2 8542.31.00.01 Microchip
DSPIC33FJ128GP802-I/SP
Microchip Technology Inc
$6.6714 Yes Yes Active 16 40 MHz 16384 40 MHz 21 7 NO 3.3 V DIGITAL SIGNAL PROCESSOR, CONTROLLER CMOS YES YES YES YES FLOATING POINT YES NO MULTIPLE YES 8 3 3 8 YES FLASH 76 mA 3.6 V 3 V INDUSTRIAL R-PDIP-T28 Not Qualified e3 85 °C -40 °C TS 16949 28 PLASTIC/EPOXY DIP DIP28,.3 RECTANGULAR IN-LINE MATTE TIN THROUGH-HOLE 2.54 mm DUAL 5.08 mm 7.62 mm 34.671 mm MICROCHIP TECHNOLOGY INC DIP DIP-28 28 compliant 3A991.A.2 8542.31.00.01 Microchip
DSPIC33FJ128GP802T-I/MM
Microchip Technology Inc
Check for Price Yes Yes Active 16 16384 40 MHz 7 YES 3.3 V DIGITAL SIGNAL PROCESSOR, CONTROLLER CMOS YES YES FLOATING POINT NO MULTIPLE YES 8 3 3 8 FLASH 75 mA 3.6 V 3 V INDUSTRIAL S-PQCC-N28 Not Qualified e3 1 85 °C -40 °C 260 TS 16949 40 28 PLASTIC/EPOXY HVQCCN LCC28,.24SQ,25 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE MATTE TIN NO LEAD 650 µm QUAD 1 mm 6 mm 6 mm MICROCHIP TECHNOLOGY INC QFN 6 X 6 MM, 0.90 MM HEIGHT, PLASTIC, QFN-28 28 compliant 3A991.A.2 8542.31.00.01 Microchip
DSPIC33FJ128GP802T-I/SO
Microchip Technology Inc
Check for Price Yes Yes Active 16 16384 40 MHz 7 YES 3.3 V DIGITAL SIGNAL PROCESSOR, CONTROLLER CMOS YES YES FLOATING POINT NO MULTIPLE YES 8 3 3 8 FLASH 75 mA 3.6 V 3 V INDUSTRIAL R-PDSO-G28 Not Qualified e3 1 85 °C -40 °C 250 TS 16949 40 28 PLASTIC/EPOXY SOP SOP28,.4 RECTANGULAR SMALL OUTLINE MATTE TIN GULL WING 1.27 mm DUAL 2.65 mm 7.5 mm 17.9 mm MICROCHIP TECHNOLOGY INC SOIC 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28 28 compliant 3A991.A.2 8542.31.00.01 Microchip
DSPIC33FJ128GP802T-E/MM
Microchip Technology Inc
Check for Price Yes Yes Active 16 16384 40 MHz 7 YES 3.3 V DIGITAL SIGNAL PROCESSOR, CONTROLLER CMOS YES YES FLOATING POINT NO MULTIPLE YES 8 3 3 8 FLASH 76 mA 3.6 V 3 V AUTOMOTIVE S-PQCC-N28 Not Qualified e3 1 125 °C -40 °C 260 TS 16949 40 28 PLASTIC/EPOXY HVQCCN LCC28,.24SQ,25 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE MATTE TIN NO LEAD 650 µm QUAD 1 mm 6 mm 6 mm MICROCHIP TECHNOLOGY INC QFN 6 X 6 MM, 0.90 MM HEIGHT, PLASTIC, QFN-28 28 compliant 3A991.A.2 8542.31.00.01
DSPIC33FJ128GP802-H/SP
Microchip Technology Inc
Check for Price Yes Yes Active 16 16384 40 MHz 7 NO 3.3 V DIGITAL SIGNAL PROCESSOR, CONTROLLER CMOS YES YES FLOATING POINT NO MULTIPLE YES 8 3 3 8 FLASH 45 mA 3.6 V 3 V AUTOMOTIVE R-PDIP-T28 Not Qualified e3 150 °C -40 °C AEC-Q100 28 PLASTIC/EPOXY DIP DIP28,.3 RECTANGULAR IN-LINE Matte Tin (Sn) THROUGH-HOLE 2.54 mm DUAL 5.08 mm 7.62 mm 34.671 mm MICROCHIP TECHNOLOGY INC DIP 0.300 INCH, LEAD FREE, PLASTIC, DIP-28 28 compliant 3A991.A.2 8542.31.00.01