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Parametric results for: Cordless Telephone ICs

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Z87L0116ASG
 Zilog Inc 		$32.2483 Yes Transferred 3.3 V CMOS CORDLESS TELEPHONE SUPPORT CIRCUIT 1 COMMERCIAL S-PQFP-G144 Not Qualified 70 °C -20 °C NOT SPECIFIED NOT SPECIFIED 144 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES GULL WING 500 µm QUAD 20 mm 20 mm 1.6 mm ZILOG INC QFP LFQFP, 144 unknown 8542.39.00.01 Cordless Telephone Support Circuit
BU8241F-E2
 ROHM Semiconductor 		Check for Price Yes Yes Obsolete 5 V CORDLESS TELEPHONE SUPPORT CIRCUIT 1 8 mA COMMERCIAL EXTENDED R-PDSO-G24 e3/e2 Not Qualified 75 °C -25 °C 260 10 24 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES TIN/TIN COPPER GULL WING 1.27 mm DUAL 5.4 mm 15 mm 1.9 mm ROHM CO LTD SOIC SOP-24 24 compliant 8542.39.00.01
TK10661QCTR
 TOKO Inc 		Check for Price Obsolete 2.4 V CORDLESS TELEPHONE SCRAMBLER/DESCRAMBLER 1 16 mA COMMERCIAL S-PQFP-G52 Not Qualified 70 °C -10 °C 52 PLASTIC/EPOXY QFP SQUARE FLATPACK YES GULL WING 650 µm QUAD 10 mm 10 mm 2.45 mm TOKO INC QFP, unknown 8542.39.00.01
ML2730DM-SR
 RF Micro Devices Inc 		Check for Price Yes Yes Obsolete 3.3 V BICMOS CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 COMMERCIAL EXTENDED S-XQCC-N40 Not Qualified 80 °C -10 °C NOT SPECIFIED NOT SPECIFIED 40 UNSPECIFIED HVQCCN LCC40,.24SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES NO LEAD 500 µm QUAD 6 mm 6 mm 1 mm RF MICRO DEVICES INC QFN HVQCCN, LCC40,.24SQ,20 40 compliant 8542.39.00.01
SA58641DK,118
 NXP Semiconductors 		Check for Price Yes Obsolete 5 V CORDLESS TELEPHONE SUPPORT CIRCUIT 1 8.5 mA INDUSTRIAL R-PDSO-G20 e4 Not Qualified 1 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 20 PLASTIC/EPOXY LSSOP RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES Nickel/Palladium/Gold (Ni/Pd/Au) GULL WING 650 µm DUAL 4.4 mm 6.5 mm 1.5 mm NXP SEMICONDUCTORS SSOP2 LSSOP, 20 unknown 8542.39.00.01 SOT266-1
NCL354MTD
 National Semiconductor Corporation 		Check for Price No Obsolete 3.3 V CMOS CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 COMMERCIAL EXTENDED R-PDSO-G56 e0 Not Qualified 80 °C -30 °C 56 PLASTIC/EPOXY TSSOP TSSOP56,.3,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES Tin/Lead (Sn/Pb) GULL WING 500 µm DUAL NATIONAL SEMICONDUCTOR CORP TSSOP, TSSOP56,.3,20 unknown 8542.39.00.01
U7004B-MFS
 Temic Semiconductors 		Check for Price Transferred 3.6 V BIPOLAR CORDLESS TELEPHONE SUPPORT CIRCUIT 1 OTHER R-PDSO-G20 Not Qualified 70 °C -25 °C 20 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE YES GULL WING DUAL TEMIC SEMICONDUCTORS SSO-20 unknown
TA31136F-TP2
 Toshiba America Electronic Components 		Check for Price Active CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT OTHER R-PDSO-G16 Not Qualified 85 °C -30 °C 16 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES GULL WING 1 mm DUAL 4.6 mm 8.2 mm 1.9 mm TOSHIBA CORP SOIC SSOP, 16 unknown 8542.39.00.01
MC13109FTA
 Motorola Semiconductor Products 		Check for Price No Obsolete 2.6 V CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 12 mA OTHER S-PQFP-G48 e0 Not Qualified 85 °C -20 °C 48 PLASTIC/EPOXY LFQFP QFP48,.35SQ,20 SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES TIN LEAD GULL WING 500 µm QUAD 7 mm 7 mm 1.6 mm MOTOROLA INC LFQFP, QFP48,.35SQ,20 unknown 8542.39.00.01
U2786B-MFSG3
 Atmel Corporation 		Check for Price No Obsolete 3 V BIPOLAR CORDLESS TELEPHONE SUPPORT CIRCUIT 1 OTHER R-PDSO-G28 Not Qualified 85 °C -25 °C 28 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES GULL WING 650 µm DUAL 4.4 mm 9.055 mm ATMEL CORP SOIC SSOP, 28 unknown 8542.39.00.01
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