Filter Your Search
1 - 10 of 765 results
|
Z87L0116ASG
Zilog Inc
|
$32.2483 | Yes | Transferred | 3.3 V | CMOS | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | COMMERCIAL | S-PQFP-G144 | Not Qualified | 70 °C | -20 °C | NOT SPECIFIED | NOT SPECIFIED | 144 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 20 mm | 20 mm | 1.6 mm | ZILOG INC | QFP | LFQFP, | 144 | unknown | 8542.39.00.01 | Cordless Telephone Support Circuit | |||||||
|
U2760B-AFSG3
Atmel Corporation
|
Check for Price | No | No | Obsolete | 2.9 V | BIPOLAR | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | 1 | COMMERCIAL | R-PDSO-G28 | e0 | Not Qualified | 45 °C | -5 °C | 28 | PLASTIC/EPOXY | SSOP | SSOP28,.25 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 650 µm | DUAL | 4.4 mm | 9.055 mm | ATMEL CORP | SOIC | PLASTIC, SSO-28 | 28 | compliant | 8542.39.00.01 | |||||||
|
ML5800DM
RF Micro Devices Inc
|
Check for Price | Obsolete | 3.3 V | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | 1 | 90 mA | COMMERCIAL | S-PQCC-N32 | Not Qualified | 60 °C | -10 °C | 32 | PLASTIC/EPOXY | HQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | YES | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 1.05 mm | RF MICRO DEVICES INC | QFJ | HQCCN, | 32 | unknown | 8542.39.00.01 | |||||||||||
|
U2762B-BFS
Telefunken Microelectronics Gmbh
|
Check for Price | No | Transferred | 3 V | BIPOLAR | COMMERCIAL | R-PDSO-G28 | e0 | Not Qualified | 70 °C | 28 | PLASTIC/EPOXY | SSOP | SSOP28,.25 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | Tin/Lead (Sn/Pb) | GULL WING | 635 µm | DUAL | TELEFUNKEN MICROELECTRONICS GMBH | unknown | 8542.39.00.01 | ||||||||||||||||
|
S1T8527C01-Q0R0
Samsung Semiconductor
|
Check for Price | Obsolete | 3.6 V | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | 1 | 7.5 mA | COMMERCIAL | S-PQFP-G48 | Not Qualified | 70 °C | -20 °C | 48 | PLASTIC/EPOXY | QFP | SQUARE | FLATPACK | YES | GULL WING | 750 µm | QUAD | 10 mm | 10 mm | 2.3 mm | SAMSUNG SEMICONDUCTOR INC | QFP | QFP, | 48 | unknown | 8542.39.00.01 | |||||||||||
|
TB31262F
Toshiba America Electronic Components
|
Check for Price | No | No | Active | 3.6 V | BICMOS | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | 1 | 84 mA | COMMERCIAL | S-PQFP-G52 | Not Qualified | 70 °C | -20 °C | NOT SPECIFIED | NOT SPECIFIED | 52 | PLASTIC/EPOXY | QFP | SQUARE | FLATPACK | YES | GULL WING | 650 µm | QUAD | 10 mm | 10 mm | 2.45 mm | TOSHIBA CORP | QFP | QFP, | 52 | unknown | 8542.39.00.01 | ||||||
|
MC13110AFB
Motorola Semiconductor Products
|
Check for Price | No | Obsolete | 3.6 V | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | 1 | 10.5 mA | INDUSTRIAL | S-PQFP-G52 | e0 | Not Qualified | 85 °C | -40 °C | 52 | PLASTIC/EPOXY | QFP | QFP52,.52SQ | SQUARE | FLATPACK | YES | TIN LEAD | GULL WING | 650 µm | QUAD | 10 mm | 10 mm | 2.45 mm | MOTOROLA INC | QFP, QFP52,.52SQ | unknown | 8542.39.00.01 | |||||||||
|
UPC8139GR-7JH
NEC Electronics Group
|
Check for Price | No | Obsolete | 3 V | BIPOLAR | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | 49 mA | COMMERCIAL EXTENDED | R-PDSO-G30 | e0 | Not Qualified | 80 °C | -30 °C | 30 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 500 µm | DUAL | 4.4 mm | 7.8 mm | 1.2 mm | NEC ELECTRONICS CORP | TSSOP | TSSOP, | 30 | compliant | 8542.39.00.01 | |||||||
|
U7006B-MLBG3
Temic Semiconductors
|
Check for Price | Transferred | 3 V | BIPOLAR | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | OTHER | R-PDSO-G16 | Not Qualified | 70 °C | -25 °C | 16 | PLASTIC/EPOXY | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | DUAL | TEMIC SEMICONDUCTORS | PLASTIC, SSO-16 | unknown | |||||||||||||||||||
|
FX118DW
CML Microcircuits Plc
|
Check for Price | Obsolete | 3.75 V | CMOS | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | 6 mA | INDUSTRIAL | R-PDSO-G16 | Not Qualified | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | DUAL | CML MICROCIRCUITS LTD | SOIC | SOP, | 16 | unknown | 8542.39.00.01 |