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Parametric results for: Cordless Telephone ICs

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Z87L0116ASG
 Zilog Inc 		$32.2483 Yes Transferred 3.3 V CMOS CORDLESS TELEPHONE SUPPORT CIRCUIT 1 COMMERCIAL S-PQFP-G144 Not Qualified 70 °C -20 °C NOT SPECIFIED NOT SPECIFIED 144 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES GULL WING 500 µm QUAD 20 mm 20 mm 1.6 mm ZILOG INC QFP LFQFP, 144 unknown 8542.39.00.01 Cordless Telephone Support Circuit
U2760B-AFSG3
 Atmel Corporation 		Check for Price No No Obsolete 2.9 V BIPOLAR CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 COMMERCIAL R-PDSO-G28 e0 Not Qualified 45 °C -5 °C 28 PLASTIC/EPOXY SSOP SSOP28,.25 RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES TIN LEAD GULL WING 650 µm DUAL 4.4 mm 9.055 mm ATMEL CORP SOIC PLASTIC, SSO-28 28 compliant 8542.39.00.01
ML5800DM
 RF Micro Devices Inc 		Check for Price Obsolete 3.3 V CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 90 mA COMMERCIAL S-PQCC-N32 Not Qualified 60 °C -10 °C 32 PLASTIC/EPOXY HQCCN SQUARE CHIP CARRIER, HEAT SINK/SLUG YES NO LEAD 500 µm QUAD 5 mm 5 mm 1.05 mm RF MICRO DEVICES INC QFJ HQCCN, 32 unknown 8542.39.00.01
U2762B-BFS
 Telefunken Microelectronics Gmbh 		Check for Price No Transferred 3 V BIPOLAR COMMERCIAL R-PDSO-G28 e0 Not Qualified 70 °C 28 PLASTIC/EPOXY SSOP SSOP28,.25 RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES Tin/Lead (Sn/Pb) GULL WING 635 µm DUAL TELEFUNKEN MICROELECTRONICS GMBH unknown 8542.39.00.01
S1T8527C01-Q0R0
 Samsung Semiconductor 		Check for Price Obsolete 3.6 V CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 7.5 mA COMMERCIAL S-PQFP-G48 Not Qualified 70 °C -20 °C 48 PLASTIC/EPOXY QFP SQUARE FLATPACK YES GULL WING 750 µm QUAD 10 mm 10 mm 2.3 mm SAMSUNG SEMICONDUCTOR INC QFP QFP, 48 unknown 8542.39.00.01
TB31262F
 Toshiba America Electronic Components 		Check for Price No No Active 3.6 V BICMOS CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 84 mA COMMERCIAL S-PQFP-G52 Not Qualified 70 °C -20 °C NOT SPECIFIED NOT SPECIFIED 52 PLASTIC/EPOXY QFP SQUARE FLATPACK YES GULL WING 650 µm QUAD 10 mm 10 mm 2.45 mm TOSHIBA CORP QFP QFP, 52 unknown 8542.39.00.01
MC13110AFB
 Motorola Semiconductor Products 		Check for Price No Obsolete 3.6 V CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 10.5 mA INDUSTRIAL S-PQFP-G52 e0 Not Qualified 85 °C -40 °C 52 PLASTIC/EPOXY QFP QFP52,.52SQ SQUARE FLATPACK YES TIN LEAD GULL WING 650 µm QUAD 10 mm 10 mm 2.45 mm MOTOROLA INC QFP, QFP52,.52SQ unknown 8542.39.00.01
UPC8139GR-7JH
 NEC Electronics Group 		Check for Price No Obsolete 3 V BIPOLAR CORDLESS TELEPHONE SUPPORT CIRCUIT 1 49 mA COMMERCIAL EXTENDED R-PDSO-G30 e0 Not Qualified 80 °C -30 °C 30 PLASTIC/EPOXY TSSOP RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES TIN LEAD GULL WING 500 µm DUAL 4.4 mm 7.8 mm 1.2 mm NEC ELECTRONICS CORP TSSOP TSSOP, 30 compliant 8542.39.00.01
U7006B-MLBG3
 Temic Semiconductors 		Check for Price Transferred 3 V BIPOLAR CORDLESS TELEPHONE SUPPORT CIRCUIT 1 OTHER R-PDSO-G16 Not Qualified 70 °C -25 °C 16 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE YES GULL WING DUAL TEMIC SEMICONDUCTORS PLASTIC, SSO-16 unknown
FX118DW
 CML Microcircuits Plc 		Check for Price Obsolete 3.75 V CMOS CORDLESS TELEPHONE SUPPORT CIRCUIT 1 6 mA INDUSTRIAL R-PDSO-G16 Not Qualified 85 °C -40 °C 16 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES GULL WING DUAL CML MICROCIRCUITS LTD SOIC SOP, 16 unknown 8542.39.00.01
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