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Parametric results for: Cordless Telephone ICs

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Z87L0116ASG
 Zilog Inc 		$32.2483 Yes Transferred 3.3 V CMOS CORDLESS TELEPHONE SUPPORT CIRCUIT 1 COMMERCIAL S-PQFP-G144 Not Qualified 70 °C -20 °C NOT SPECIFIED NOT SPECIFIED 144 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES GULL WING 500 µm QUAD 20 mm 20 mm 1.6 mm ZILOG INC QFP LFQFP, 144 unknown 8542.39.00.01 Cordless Telephone Support Circuit
U7006B-MLBY
 Atmel Corporation 		Check for Price Yes Yes Obsolete 3 V BIPOLAR CORDLESS TELEPHONE SUPPORT CIRCUIT 1 OTHER R-PDSO-G16 e3 Not Qualified 2 70 °C -25 °C 260 16 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES MATTE TIN GULL WING 635 µm DUAL 3.9116 mm 4.9 mm 1.75 mm ATMEL CORP SOIC SSOP, 16 compliant 8542.39.00.01
U2760B-AFSG3
 Temic Semiconductors 		Check for Price No Transferred 2.9 V BIPOLAR CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 COMMERCIAL R-PDSO-G28 e0 Not Qualified 45 °C -5 °C 28 PLASTIC/EPOXY SSOP SSOP28,.25 RECTANGULAR SMALL OUTLINE YES Tin/Lead (Sn/Pb) GULL WING 635 µm DUAL TEMIC SEMICONDUCTORS PLASTIC, SSO-28 unknown
TEA1118ATD-T
 NXP Semiconductors 		Check for Price Obsolete 2.9 V BIPOLAR CORDLESS TELEPHONE BASEBAND CIRCUIT 1 1.4 mA COMMERCIAL EXTENDED R-PDSO-G14 Not Qualified 75 °C -25 °C 14 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES GULL WING 1.27 mm DUAL 3.9 mm 8.65 mm 1.75 mm NXP SEMICONDUCTORS SOIC SOP, 14 unknown 8542.39.00.01
SC14404BXXBC
 Texas Instruments 		Check for Price Obsolete CMOS CORDLESS TELEPHONE BASEBAND CIRCUIT 1 S-PBGA-B100 Not Qualified 100 PLASTIC/EPOXY LFBGA SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 10 mm 10 mm 1.5 mm NATIONAL SEMICONDUCTOR CORP LFBGA, unknown 8542.39.00.01
TA8103F
 Toshiba America Electronic Components 		Check for Price Active 2.5 V CORDLESS TELEPHONE SUPPORT CIRCUIT 1 COMMERCIAL EXTENDED R-PDSO-G24 Not Qualified 80 °C -30 °C 24 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES GULL WING 1 mm DUAL 6 mm 13 mm 2.2 mm TOSHIBA CORP SSOP SSOP, 24 unknown 8542.39.00.01
TA31101AF(ER)
 Toshiba America Electronic Components 		Check for Price No No Active 3 V BIPOLAR CORDLESS TELEPHONE SUPPORT CIRCUIT 1 5 mA COMMERCIAL EXTENDED R-PDSO-G16 e0 Not Qualified 75 °C -25 °C 16 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES TIN LEAD GULL WING 1 mm DUAL 4.6 mm 8.2 mm 1.9 mm TOSHIBA CORP SOIC SSOP, 16 unknown 8542.39.00.01
SM5130AP
 Nippon Precision Circuits Inc 		Check for Price No Transferred CMOS COMMERCIAL EXTENDED R-PDIP-T16 e0 Not Qualified 80 °C -30 °C 16 PLASTIC/EPOXY DIP DIP16,.3 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL NIPPON PRECISION CIRCUITS INC DIP-16 unknown 8542.39.00.01
ML5800DM-SB
 RF Micro Devices Inc 		Check for Price Yes Obsolete 3.3 V CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 90 mA COMMERCIAL S-PQCC-N32 e3 Not Qualified 60 °C -10 °C 32 PLASTIC/EPOXY HVQCCN LCC32,.2SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES Matte Tin (Sn) NO LEAD 500 µm QUAD 5 mm 5 mm 1 mm RF MICRO DEVICES INC QFN HVQCCN, LCC32,.2SQ,20 32 unknown 8542.39.00.01
TA31101AF-TP2
 Toshiba America Electronic Components 		Check for Price No No Active 3 V BIPOLAR CORDLESS TELEPHONE SUPPORT CIRCUIT 1 5 mA COMMERCIAL EXTENDED R-PDSO-G16 e0 Not Qualified 75 °C -25 °C 16 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES TIN LEAD GULL WING 1 mm DUAL 4.6 mm 8.2 mm 1.9 mm TOSHIBA CORP SOIC SSOP, 16 unknown 8542.39.00.01
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