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Z87L0116ASG
Zilog Inc
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$32.2483 | Yes | Transferred | 3.3 V | CMOS | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | COMMERCIAL | S-PQFP-G144 | Not Qualified | 70 °C | -20 °C | NOT SPECIFIED | NOT SPECIFIED | 144 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 20 mm | 20 mm | 1.6 mm | ZILOG INC | QFP | LFQFP, | 144 | unknown | 8542.39.00.01 | Cordless Telephone Support Circuit | ||||||||
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MC13110FB
Freescale Semiconductor
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Check for Price | No | Obsolete | 3.6 V | 3.6 V | 12 mA | INDUSTRIAL | S-PQFP-G52 | e0 | Not Qualified | 85 °C | -40 °C | 52 | PLASTIC/EPOXY | QFP | QFP52,.52SQ | SQUARE | FLATPACK | YES | Tin/Lead (Sn/Pb) | GULL WING | 635 µm | QUAD | MOTOROLA SEMICONDUCTOR PRODUCTS | QFP, QFP52,.52SQ | unknown | |||||||||||||||
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TA31136FG
Toshiba America Electronic Components
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Check for Price | Active | 2 V | BIPOLAR | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | 1 | 4.6 µA | OTHER | R-PDSO-G16 | e2 | Not Qualified | 85 °C | -30 °C | 16 | PLASTIC/EPOXY | SSOP | SOP16,.25,40 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | TIN SILVER | GULL WING | 1 mm | DUAL | 4.6 mm | 8.2 mm | 1.9 mm | TOSHIBA CORP | SOIC | SSOP, SOP16,.25,40 | 16 | unknown | 8542.39.00.01 | ||||||||
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PCD5041HZ
NXP Semiconductors
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Check for Price | Obsolete | 3 V | CMOS | CORDLESS TELEPHONE BURST MODE CONTROLLER | 1 | OTHER | S-PQFP-G80 | Not Qualified | 70 °C | -25 °C | 80 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 12 mm | 12 mm | 1.6 mm | NXP SEMICONDUCTORS | LFQFP, | unknown | 8542.39.00.01 | ||||||||||||||
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TRM5F-J
Mitsumi Electric Co Ltd
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Check for Price | Obsolete | 2.4 V | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | 1 | R-XXMA-X | Not Qualified | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | UNSPECIFIED | UNSPECIFIED | MITSUMI ELECTRIC CO LTD | , | unknown | 8542.39.00.01 | ||||||||||||||||||||||||
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FX118DW
CML Microcircuits Plc
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Check for Price | Obsolete | 3.75 V | CMOS | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | 6 mA | INDUSTRIAL | R-PDSO-G16 | Not Qualified | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | DUAL | CML MICROCIRCUITS LTD | SOIC | SOP, | 16 | unknown | 8542.39.00.01 | |||||||||||||||
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HPMX-5002-TY1
Avago Technologies
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Check for Price | Obsolete | 3 V | CORDLESS TELEPHONE BASEBAND CIRCUIT | 1 | S-PQFP-G48 | Not Qualified | 48 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 7 mm | 7 mm | 1.6 mm | AVAGO TECHNOLOGIES INC | QFP | LFQFP, | 48 | unknown | 8542.39.00.01 | ||||||||||||||||
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AK2353LV
Asahi Kasei Microsystems Corporation
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Check for Price | No | Obsolete | CMOS | 9.4 µA | COMMERCIAL | S-PQFP-G64 | e0 | Not Qualified | 70 °C | -10 °C | 64 | PLASTIC/EPOXY | QFP | QFP64,.47SQ,20 | SQUARE | FLATPACK | YES | Tin/Lead (Sn/Pb) | GULL WING | 500 µm | QUAD | ASAHI KASEI MICRODEVICES CORP | QFP, QFP64,.47SQ,20 | unknown | 8542.39.00.01 | |||||||||||||||
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HHM0130
TDK Corporation
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Check for Price | Obsolete | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | COMMERCIAL | R-PDMW-N6 | Not Qualified | 60 °C | -10 °C | 6 | PLASTIC/EPOXY | RECTANGULAR | MICROWAVE | YES | NO LEAD | DUAL | TDK CORP | , | unknown | 8542.39.00.01 | |||||||||||||||||||||
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935277007112
NXP Semiconductors
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Check for Price | Obsolete | 5 V | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | INDUSTRIAL | R-PDSO-G20 | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 4.4 mm | 6.5 mm | 1.5 mm | NXP SEMICONDUCTORS | LSSOP, | unknown |