Parametric results for: MASK ROMs

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OWB065SDY0
Epson Electronics America Inc
Check for Price Obsolete 32.768 kbit 8 4KX8 5 V 300 ns MASK ROM 16 1 64000 65.536 k ASYNCHRONOUS 3-STATE PARALLEL 70 µA 5.5 V 4.5 V CMOS COMMERCIAL X-XXMA-X68 Not Qualified 60 °C 68 UNSPECIFIED UNSPECIFIED MICROELECTRONIC ASSEMBLY NO UNSPECIFIED UNSPECIFIED SEIKO EPSON CORP , unknown EAR99 8542.32.00.71
AM27X512-70JI
Spansion
Check for Price Transferred SPANSION INC , unknown EAR99 8542.32.00.71
MR53V3252J-XXTP
LAPIS Semiconductor Co Ltd
Check for Price No Obsolete 8.5899 Gbit 32 256MX32 3.3 V 20 ns MASK ROM 8 1 2000000 2.0972 M ASYNCHRONOUS PARALLEL 1 mA 70 µA 3.6 V 3 V CMOS COMMERCIAL R-PDSO-G44 Not Qualified e0 70 °C 44 PLASTIC/EPOXY TSOP TSOP44,.46,32 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES Tin/Lead (Sn/Pb) GULL WING 800 µm DUAL LAPIS SEMICONDUCTOR CO LTD TSOP, TSOP44,.46,32 unknown EAR99 8542.32.00.71
MB832000-20M
FUJITSU Limited
Check for Price Obsolete 32.768 kbit 8 4KX8 5 V 120 ns MASK ROM 1 256000 262.144 k ASYNCHRONOUS PARALLEL 40 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PDIP-T32 Not Qualified 70 °C 32 PLASTIC/EPOXY DIP RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL 5 mm 40.44 mm 15.24 mm FUJITSU SEMICONDUCTOR AMERICA INC DIP, unknown EAR99 8542.32.00.71 DIP 32
HN62415P-20
Hitachi Ltd
Check for Price No Transferred 4.1943 Mbit 8 512KX8 5 V 200 ns MASK ROM 16 1 512000 524.288 k ASYNCHRONOUS 3-STATE PARALLEL 30 µA 50 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PDIP-T40 Not Qualified e0 70 °C 40 PLASTIC/EPOXY DIP DIP40,.6 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL 5.08 mm 52.8 mm 15.24 mm HITACHI LTD DIP, DIP40,.6 unknown EAR99 8542.32.00.71 DIP 40
LH53H4000T
Sharp Corp
Check for Price Obsolete 4.1943 Mbit 8 512KX8 5 V 80 ns MASK ROM CONFIGURABLE AS 256K X 16 1 512000 524.288 k ASYNCHRONOUS 100 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PDSO-G48 Not Qualified 70 °C 48 PLASTIC/EPOXY TSOP1 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES GULL WING 500 µm DUAL 1.2 mm 16.4 mm 12 mm SHARP CORP 12 X 18 MM, PLASTIC, TSOP1-48 unknown
RO9C256-20/K
Microchip Technology Inc
Check for Price No Obsolete 33.5544 Mbit 16 2MX16 3 V 100 ns MASK ROM 1 32000 32.768 k ASYNCHRONOUS PARALLEL 100 µA 20 µA 3.6 V 2.7 V CMOS COMMERCIAL R-XQCC-N32 Not Qualified e0 70 °C 32 CERAMIC QCCN LCC32,.45X.55 RECTANGULAR CHIP CARRIER YES Tin/Lead (Sn/Pb) NO LEAD 1.27 mm QUAD MICROCHIP TECHNOLOGY INC unknown EAR99 8542.32.00.71
KM23C32100FP-15
Samsung Semiconductor
Check for Price No No Obsolete 33.5544 Mbit 8 4MX8 5 V 150 ns MASK ROM 16 1 4000000 4.1943 M ASYNCHRONOUS 3-STATE PARALLEL 100 µA 100 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PQFP-G64 Not Qualified e0 70 °C 64 PLASTIC/EPOXY QFP QFP64,.7X.95,40 RECTANGULAR FLATPACK YES TIN LEAD GULL WING 1 mm QUAD 2.75 mm 20 mm 14 mm SAMSUNG SEMICONDUCTOR INC QFP, QFP64,.7X.95,40 compliant EAR99 8542.32.00.71 QFP 64
AM27X1024-200XC
AMD
Check for Price Obsolete 1.0486 Mbit 16 64KX16 5 V 200 ns MASK ROM 1 64000 65.536 k ASYNCHRONOUS 3-STATE PARALLEL 200 µA 50 µA 5.5 V 4.5 V CMOS COMMERCIAL R-XUUC-N39 Not Qualified 70 °C 39 UNSPECIFIED DIE DIE OR CHIP RECTANGULAR UNCASED CHIP YES NO LEAD UPPER ADVANCED MICRO DEVICES INC DIE, DIE OR CHIP unknown EAR99 8542.32.00.71 DIE 39
NSC830D-4/A+
National Semiconductor Corporation
Check for Price No Obsolete 16.384 kbit 8 2KX8 5 V 300 ns MASK ROM 1 2000 2.048 k ASYNCHRONOUS PARALLEL 10 µA CMOS COMMERCIAL R-XDIP-T40 e0 70 °C 40 CERAMIC DIP DIP40,.6 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL NATIONAL SEMICONDUCTOR CORP DIP, DIP40,.6 unknown EAR99 8542.32.00.71