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OWB065SDY0
Epson Electronics America Inc
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Check for Price | Obsolete | 32.768 kbit | 8 | 4KX8 | 5 V | 300 ns | MASK ROM | 16 | 1 | 64000 | 65.536 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 70 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | X-XXMA-X68 | Not Qualified | 60 °C | 68 | UNSPECIFIED | UNSPECIFIED | MICROELECTRONIC ASSEMBLY | NO | UNSPECIFIED | UNSPECIFIED | SEIKO EPSON CORP | , | unknown | EAR99 | 8542.32.00.71 | ||||||||||||||||
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AM27X512-70JI
Spansion
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Check for Price | Transferred | SPANSION INC | , | unknown | EAR99 | 8542.32.00.71 | ||||||||||||||||||||||||||||||||||||||||||||
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MR53V3252J-XXTP
LAPIS Semiconductor Co Ltd
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Check for Price | No | Obsolete | 8.5899 Gbit | 32 | 256MX32 | 3.3 V | 20 ns | MASK ROM | 8 | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | PARALLEL | 1 mA | 70 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G44 | Not Qualified | e0 | 70 °C | 44 | PLASTIC/EPOXY | TSOP | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | Tin/Lead (Sn/Pb) | GULL WING | 800 µm | DUAL | LAPIS SEMICONDUCTOR CO LTD | TSOP, TSOP44,.46,32 | unknown | EAR99 | 8542.32.00.71 | ||||||||||
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MB832000-20M
FUJITSU Limited
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Check for Price | Obsolete | 32.768 kbit | 8 | 4KX8 | 5 V | 120 ns | MASK ROM | 1 | 256000 | 262.144 k | ASYNCHRONOUS | PARALLEL | 40 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDIP-T32 | Not Qualified | 70 °C | 32 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5 mm | 40.44 mm | 15.24 mm | FUJITSU SEMICONDUCTOR AMERICA INC | DIP, | unknown | EAR99 | 8542.32.00.71 | DIP | 32 | |||||||||||
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HN62415P-20
Hitachi Ltd
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Check for Price | No | Transferred | 4.1943 Mbit | 8 | 512KX8 | 5 V | 200 ns | MASK ROM | 16 | 1 | 512000 | 524.288 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 30 µA | 50 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDIP-T40 | Not Qualified | e0 | 70 °C | 40 | PLASTIC/EPOXY | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 52.8 mm | 15.24 mm | HITACHI LTD | DIP, DIP40,.6 | unknown | EAR99 | 8542.32.00.71 | DIP | 40 | ||||
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LH53H4000T
Sharp Corp
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Check for Price | Obsolete | 4.1943 Mbit | 8 | 512KX8 | 5 V | 80 ns | MASK ROM | CONFIGURABLE AS 256K X 16 | 1 | 512000 | 524.288 k | ASYNCHRONOUS | 100 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDSO-G48 | Not Qualified | 70 °C | 48 | PLASTIC/EPOXY | TSOP1 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 500 µm | DUAL | 1.2 mm | 16.4 mm | 12 mm | SHARP CORP | 12 X 18 MM, PLASTIC, TSOP1-48 | unknown | |||||||||||||||
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RO9C256-20/K
Microchip Technology Inc
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Check for Price | No | Obsolete | 33.5544 Mbit | 16 | 2MX16 | 3 V | 100 ns | MASK ROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 100 µA | 20 µA | 3.6 V | 2.7 V | CMOS | COMMERCIAL | R-XQCC-N32 | Not Qualified | e0 | 70 °C | 32 | CERAMIC | QCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | NO LEAD | 1.27 mm | QUAD | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8542.32.00.71 | ||||||||||||
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KM23C32100FP-15
Samsung Semiconductor
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Check for Price | No | No | Obsolete | 33.5544 Mbit | 8 | 4MX8 | 5 V | 150 ns | MASK ROM | 16 | 1 | 4000000 | 4.1943 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 100 µA | 100 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PQFP-G64 | Not Qualified | e0 | 70 °C | 64 | PLASTIC/EPOXY | QFP | QFP64,.7X.95,40 | RECTANGULAR | FLATPACK | YES | TIN LEAD | GULL WING | 1 mm | QUAD | 2.75 mm | 20 mm | 14 mm | SAMSUNG SEMICONDUCTOR INC | QFP, QFP64,.7X.95,40 | compliant | EAR99 | 8542.32.00.71 | QFP | 64 | |||
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AM27X1024-200XC
AMD
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Check for Price | Obsolete | 1.0486 Mbit | 16 | 64KX16 | 5 V | 200 ns | MASK ROM | 1 | 64000 | 65.536 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 200 µA | 50 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-XUUC-N39 | Not Qualified | 70 °C | 39 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | YES | NO LEAD | UPPER | ADVANCED MICRO DEVICES INC | DIE, DIE OR CHIP | unknown | EAR99 | 8542.32.00.71 | DIE | 39 | ||||||||||||
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NSC830D-4/A+
National Semiconductor Corporation
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Check for Price | No | Obsolete | 16.384 kbit | 8 | 2KX8 | 5 V | 300 ns | MASK ROM | 1 | 2000 | 2.048 k | ASYNCHRONOUS | PARALLEL | 10 µA | CMOS | COMMERCIAL | R-XDIP-T40 | e0 | 70 °C | 40 | CERAMIC | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | NATIONAL SEMICONDUCTOR CORP | DIP, DIP40,.6 | unknown | EAR99 | 8542.32.00.71 |